XC2S100-5FGG256I

The XC2S100-5FGG256I is an AMD Spartan®-II field programmable gate array packaged in a 256‑ball BGA (256‑FBGA, 17×17). It provides 2,700 logic elements, approximately 0.041 Mbits of embedded memory, and up to 176 user I/O for mid-density programmable logic requirements.

With an industrial operating temperature range and RoHS compliance, this device addresses board‑level FPGA needs where a balance of logic density, I/O count, and compact surface‑mount packaging is required.

Key Features

• Logic Capacity — 2,700 logic elements (cells) and approximately 100,000 gates provide moderate programmable logic resources for mid-density designs.
• Configurable Logic Blocks — 600 CLB equivalents (as listed) offering the fabric for implementing custom logic functions and glue logic.
• Embedded Memory — Approximately 0.041 Mbits (40,960 bits) of on-chip RAM to support buffering, FIFOs, and small lookup tables.
• I/O Density — 176 user I/O pins to support multi-interface systems and extensive board-level signaling.
• Package & Mounting — 256‑BGA package (supplier device package: 256‑FBGA, 17×17) in a surface‑mount form factor for compact PCB integration.
• Power — Core/IO supply specified across 2.375 V to 2.625 V providing defined operating voltage bounds for system power design.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature‑demanding environments.
• Compliance — RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Industrial Control — Industrial‑grade operating range and packaging make this FPGA suitable for control logic, sensor interfacing, and automation subsystems.
• Board‑Level Logic Integration — Use as glue logic, protocol conversion, or custom peripheral interfaces where moderate logic density and high I/O count are required.
• Compact Embedded Systems — 256‑BGA surface‑mount packaging supports space‑constrained designs that need reconfigurable logic and on‑chip RAM.

Unique Advantages

• Balanced Logic and Memory: 2,700 logic elements with approximately 0.041 Mbits of embedded RAM allows implementation of control and buffering functions without external memory for many mid‑range tasks.
• High I/O Count: 176 I/O pins enable multiple parallel interfaces or mixed‑signal board connectivity, reducing the need for external multiplexers.
• Industrial Robustness: Rated from −40 °C to 100 °C and supplied in a surface‑mount BGA package to meet industrial deployment requirements.
• Compact Package: 256‑FBGA (17×17) provides a small board footprint while delivering substantial I/O and logic capacity for PCB‑level integration.
• Defined Power Envelope: Narrow supply range of 2.375 V to 2.625 V simplifies power rail design and decoupling strategies for the FPGA core.
• Manufacturing‑Friendly: Surface‑mount BGA format and RoHS compliance support modern assembly and environmental requirements.

Why Choose XC2S100-5FGG256I?

The XC2S100-5FGG256I delivers a practical combination of logic resources, embedded memory, and high I/O count in a compact 256‑BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for long‑life, board‑level applications that require reliable reconfigurable logic without excess complexity.

This device is well suited for engineers designing mid‑density FPGA implementations needing predictable voltage and thermal operating bounds, compact surface‑mount integration, and a clear balance of logic, memory, and I/O for industrial or embedded systems.

Request a quote today to check availability and pricing for the XC2S100-5FGG256I and discuss how it can fit your next mid‑density FPGA design.