XC2S100-5PQG208I

The XC2S100-5PQG208I is a Spartan®-II family Field Programmable Gate Array (FPGA) supplied in a 208-pin BFQFP package. It provides a balanced combination of logic capacity, on-chip memory and I/O density suitable for embedded and industrial applications.

Key device attributes include 2,700 logic elements, approximately 40 Kbits of embedded RAM, 140 user I/Os, a 2.375–2.625 V core supply range, and an industrial operating temperature range of -40 °C to 100 °C.

Key Features

• Core and Logic Capacity — 2,700 logic elements and 100,000 equivalent gates delivering moderate combinational and sequential logic resources for custom digital functions.
• Configurable Logic Blocks (CLBs) — 600 logic blocks (CLBs) for structured implementation of logic, state machines and glue logic.
• Embedded Memory — Approximately 40 Kbits of on-chip RAM (40,960 bits) to support buffering, FIFOs and small data stores without external memory.
• I/O and Connectivity — 140 user I/Os to accommodate parallel interfaces, control signals and peripheral connections directly at the device.
• Power — Operates from a defined core supply range of 2.375 V to 2.625 V, enabling predictable power budgeting in system design.
• Package and Mounting — Surface-mount 208-BFQFP package; supplier device package listed as 208-PQFP (28×28), supporting compact PCB layouts.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C, suitable for temperature-challenging environments.
• Regulatory — RoHS compliant to meet lead-free assembly requirements.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and rugged electrical characteristics make this FPGA suitable for control and automation logic in industrial environments.
• I/O-Intensive Interfaces — With 140 user I/Os, the device is well suited for designs that require dense parallel signaling, front-panel interfaces or multiple peripheral connections.
• Embedded Logic and Glue — The combined logic resources (2,700 logic elements and 600 CLBs) and on-chip RAM support implementation of custom state machines, protocol bridging and glue logic within compact systems.

Unique Advantages

• Integrated Logic and Memory: 2,700 logic elements paired with approximately 40 Kbits of embedded RAM reduce reliance on external components for buffering and small data storage.
• High I/O Density: 140 user I/Os simplify board-level routing by accommodating multiple interfaces and signals directly on-chip.
• Industrial-Grade Operation: Rated for -40 °C to 100 °C and listed as Industrial grade, providing design assurance for temperature-stressed deployments.
• Compact, Surface-Mount Packaging: 208-BFQFP (supplier: 208-PQFP 28×28) enables a space-efficient implementation on standard PCBs.
• Predictable Power Requirements: Defined supply range of 2.375 V to 2.625 V assists system power-tree planning and voltage regulation selection.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC2S100-5PQG208I?

The XC2S100-5PQG208I offers a practical combination of logic capacity, embedded memory and a high I/O count in a compact, surface-mount package. Its industrial temperature rating and RoHS compliance make it an appropriate option for designs that require reliable operation across a wide temperature range and adherence to lead-free assembly standards.

This device is well suited for engineering teams building embedded systems that need moderate gate counts, local RAM for buffering, and substantial I/O connectivity while maintaining a concise board footprint and predictable power characteristics.

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