XC2S100-5TQG144C

The XC2S100-5TQG144C is a Spartan®-II Field Programmable Gate Array (FPGA) from AMD, offering a balanced combination of logic capacity, on-chip memory, and I/O density in a compact surface-mount package. With 2,700 logic elements, approximately 40 Kbits of embedded RAM and 92 user I/Os, this commercial-grade device targets moderate-complexity programmable logic tasks where integration and board-level density matter.

Operating from a 2.375 V to 2.625 V supply and specified for 0 °C to 85 °C, the device is RoHS compliant and supplied in a 144-pin LQFP/TQFP footprint suitable for standard PCB assembly.

Key Features

• Core Logic 2,700 logic elements delivering capacity for up to 100,000 gates of combinational and sequential logic.
• Embedded Memory Approximately 40 Kbits (40,960 bits) of on-chip RAM for small data buffers, FIFOs, and state storage.
• I/O Resources 92 user I/O pins provide ample connectivity for peripherals, buses and external interfaces.
• Device Capacity Rated at 100,000 gates, enabling a range of moderate-complexity logic implementations.
• Power Operates from a 2.375 V to 2.625 V supply range to match system power rails.
• Package and Mounting Surface-mount 144-pin package (144-LQFP; supplier package listed as 144-TQFP 20×20) for compact, high-density PCB designs.
• Operating Conditions Commercial temperature grade specified from 0 °C to 85 °C.
• Environmental RoHS compliant for lead-free assembly processes.

Typical Applications

• General-purpose programmable logic Implement glue logic, finite-state machines and custom digital functions using the device's 2,700 logic elements and 100k-gate capacity.
• On-chip buffering and small data storage Use the approximately 40 Kbits of embedded RAM for FIFOs, small buffers or scratch storage without external memory.
• Peripheral and bus interfacing Leverage 92 I/O pins to connect sensors, controllers, or peripheral devices with reduced external glue logic.
• Compact board designs The 144-pin LQFP/TQFP surface-mount package supports high-density PCB layouts for space-constrained applications.

Unique Advantages

• Balanced integration: 2,700 logic elements coupled with embedded RAM offer a compact platform for moderate-complexity designs, reducing the need for external components.
• High I/O count: 92 user I/Os simplify board-level interfacing and lower BOM by minimizing external translators and buffers.
• Compact package footprint: 144-LQFP/144-TQFP surface-mount package enables denser PCB routing and smaller overall board area.
• Commercial temperature suitability: Specified 0 °C to 85 °C operation for standard commercial applications.
• Regulatory readiness: RoHS compliance supports lead-free assembly processes and regulatory requirements.

Why Choose XC2S100-5TQG144C?

The XC2S100-5TQG144C delivers a practical combination of logic capacity, embedded memory and I/O resources in a compact surface-mount package from AMD’s Spartan®-II family. It is well suited to designers and procurement teams seeking a commercially graded FPGA for moderate-complexity digital functions, interface logic, and on-board buffering without excess overhead.

With defined supply and temperature ranges plus RoHS compliance, this device provides predictable electrical and environmental behavior for mainstream commercial products, supporting efficient board-level integration and streamlined BOMs.

Request a quote or submit an inquiry to obtain pricing and availability for the XC2S100-5TQG144C and to discuss how this Spartan®-II FPGA can fit your next design.