XC2S100-6FGG256C

The XC2S100-6FGG256C is a Spartan®-II field programmable gate array (FPGA) IC from AMD. It integrates approximately 2,700 logic elements and about 40,960 bits of on-chip RAM with a device capacity of 100,000 gates, delivering a compact, programmable logic resource in a 256-ball BGA footprint.

Key physical and system-level attributes include 176 I/O pins, a 256-FBGA (17×17) surface-mount package, a supply voltage range of 2.375 V to 2.625 V, RoHS compliance, and a commercial operating temperature range of 0 °C to 85 °C—characteristics suited to a wide range of commercial embedded designs.

Key Features

• Logic Capacity  Approximately 2,700 logic elements and a device capacity of 100,000 gates to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 40,960 bits of on-chip RAM for buffering, small-lookups, and local data storage.
• I/O and Connectivity  176 user I/O pins provide flexible connectivity for external interfaces and peripherals.
• Package and Mounting  256-ball BGA in a 256-FBGA (17×17) configuration with surface-mount package style for compact PCB integration.
• Power  Core supply range of 2.375 V to 2.625 V to match design power requirements.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Unique Advantages

• Balanced logic and memory resources: The combination of ~2,700 logic elements and ~40,960 bits of embedded RAM supports mixed logic and data buffering needs without external memory in many use cases.
• High I/O count in a compact footprint: 176 I/O pins in a 256-FBGA (17×17) package enable dense connectivity while conserving board area.
• Low-voltage core compatibility: Narrow supply range (2.375 V–2.625 V) simplifies power-supply design for systems targeting this core voltage.
• Commercial temperature suitability: Rated 0 °C to 85 °C for general commercial and consumer applications where this operating range is appropriate.
• Surface-mount packaging: 256-ball BGA surface-mount package supports modern assembly processes and compact PCB layouts.
• RoHS-compliant: Environmentally compliant construction for designs that require lead-free components.

Why Choose XC2S100-6FGG256C?

The XC2S100-6FGG256C positions itself as a practical FPGA choice for commercial embedded designs that require a modest mix of logic, on-chip RAM, and a substantial I/O count within a compact 256-BGA footprint. Its specifications—approximately 2,700 logic elements, ~40,960 bits of embedded memory, 176 I/Os, and a defined supply and temperature range—make it suitable for developers seeking predictable, documented device behavior in a Spartan®-II family device from AMD.

For design teams focused on board-area efficiency, straightforward power requirements, and compliance with RoHS, the XC2S100-6FGG256C offers a clear, verifiable specification set that supports long-term product planning and deployment in commercial applications.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2S100-6FGG256C.