XC2S100E-6FT256C

IC FPGA 182 I/O 256FTBGA
Part Description

Spartan®-IIE Field Programmable Gate Array (FPGA) IC 182 40960 2700 256-LBGA

Quantity 1,138 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O182Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates100000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XC2S100E-6FT256C – Spartan®-IIE FPGA, 256-LBGA, 2700 logic elements

The XC2S100E-6FT256C is a Spartan®-IIE Field-Programmable Gate Array (FPGA) in a 256-LBGA package designed for cost-sensitive, reprogrammable digital logic applications. Built on the Spartan-IIE family architecture, it offers a compact, surface-mount FPGA option with 2700 logic elements, 182 I/O pins, and on-chip memory for mid-density designs.

Its architecture supports common system and interface tasks while providing in-system reprogrammability and family-level features such as block RAM and dedicated clock DLLs for timing control.

Key Features

  • Logic Capacity  2700 logic elements (equivalent cells) and approximately 100,000 system gates for mid-density integration of digital functions.
  • Embedded Memory  40,960 bits of on-chip RAM (approximately 0.04 Mbits) to support buffering, FIFOs, and small embedded data structures.
  • I/O Resources  182 user I/O pins suitable for a wide range of parallel and serial interfaces; package supports a broad set of interface requirements.
  • Clock and Timing  Spartan-IIE family architecture includes dedicated Delay-Locked Loop (DLL) resources for advanced clock control and predictable timing behavior.
  • Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board layouts.
  • Power and Operating Range  Core voltage supply range 1.71 V to 1.89 V and commercial operating temperature 0 °C to 85 °C.
  • Standards and Compliance  RoHS compliant for lead-free manufacturing and environmental requirements.

Typical Applications

  • ASIC Replacement and Prototyping  Use the FPGA for cost-effective alternatives to mask-programmed ASICs and for rapid design iterations with in-system reprogrammability.
  • Embedded Control and Glue Logic  Implement glue logic, protocol translation, and control finite-state machines using the device's logic elements and on-chip RAM.
  • Interface Bridging  Leverage 182 I/O pins to connect multiple peripherals, sensors, or memory interfaces in mid-density system designs.
  • Timing-Critical Designs  Use on-chip DLLs and predictable routing characteristics for designs that require controlled clocking and timing consistency.

Unique Advantages

  • Highly integrated mid-density FPGA: Combines 2700 logic elements, 40,960 bits of embedded memory, and 182 I/Os to reduce external component count and simplify board design.
  • Compact BGA footprint: 256-LBGA surface-mount package enables high-density PCB layouts while maintaining robust I/O availability.
  • Flexible clocking: Built-in DLL resources provide phase shift, multiply/divide, and low-skew clock distribution options to simplify timing architectures.
  • Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronics applications.
  • RoHS compliant: Supports lead-free manufacturing and meets environmental regulatory requirements.
  • Predictable performance from Spartan-IIE architecture: Family-level features such as dedicated carry logic and block RAM support common arithmetic and buffering needs.

Why Choose XC2S100E-6FT256C?

The XC2S100E-6FT256C positions itself as a practical FPGA for designers who need a balance of logic capacity, I/O density, and embedded memory in a compact, surface-mount package. Its Spartan-IIE architecture provides predictable timing behavior and on-chip resources that simplify system design and reduce BOM complexity.

This device is well suited for engineering teams building mid-density digital subsystems, prototype platforms, or interface-centric modules that benefit from in-system reprogrammability, dedicated clock resources, and commercial-grade operating conditions. Sourcing this part delivers a reprogrammable platform backed by the Spartan-IIE family specifications and datasheet guidance.

Request a quote or submit an inquiry to get pricing and availability for the XC2S100E-6FT256C and support for integration into your design.

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