XC2S100E-6PQG208C

The XC2S100E-6PQG208C is a commercial-grade Spartan®-IIE Field Programmable Gate Array (FPGA) in a 208-BFQFP package. It provides reprogrammable logic resources, embedded RAM, and a broad set of I/O in a surface-mount package suited for cost-sensitive digital designs and prototyping.

With 2700 logic elements and approximately 40,960 bits of on-chip RAM, this device targets applications that require mid-density programmable logic, flexible I/O, and a compact package footprint while operating within a 1.71 V to 1.89 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Core Logic 2700 logic elements and 600 configurable logic blocks (CLBs) provide mid-range programmable logic capacity for glue logic, control state machines, and moderate-complexity processing tasks.
• Embedded Memory Approximately 40,960 total RAM bits of on-chip memory for FIFOs, small buffers, and local storage.
• I/O Count 146 user I/O pins available for flexible interfacing to peripherals, sensors, and external devices.
• System Gates Approximately 100,000 system gates for design partitioning and integration of multiple functions into a single device.
• Package & Mounting 208-BFQFP (supplier package: 208-PQFP, 28×28) surface-mount package balances pin count and PCB footprint for compact board layouts.
• Supply & Temperature Recommended operating supply range of 1.71 V to 1.89 V with a commercial operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Prototyping and ASIC Replacement Use the device’s reprogrammable logic and on-chip memory to prototype designs or replace mask-programmed ASICs where reconfigurability and lower upfront cost matter.
• Embedded Control and Interfaces Mid-density logic and 146 I/Os suit control tasks, protocol bridging, and peripheral interfacing on compact boards.
• Data buffering and local storage The on-chip RAM provides compact FIFO and buffer implementations for modest-throughput data paths.
• Compact System Integration The 208-BFQFP surface-mount package enables integration of programmable logic into space-constrained consumer or commercial electronics.

Unique Advantages

• Balanced mid-range capacity: 2700 logic elements and 600 CLBs provide a practical mix of resources for many control, interfacing, and logic-integration tasks without excess complexity.
• On-chip memory for local buffering: Approximately 40,960 bits of embedded RAM reduce the need for external memory in moderate buffering and FIFO applications.
• High pin count in a compact package: 146 I/Os in a 208-BFQFP offer broad connectivity while maintaining a manageable PCB footprint.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation and a narrow supply voltage window (1.71 V to 1.89 V) allow predictable behavior in standard commercial environments.
• RoHS compliant: Lead-free compliance supports modern manufacturing requirements and environmental standards.

Why Choose XC2S100E-6PQG208C?

The XC2S100E-6PQG208C delivers a practical, reprogrammable solution for engineers needing mid-density logic, moderate embedded memory, and extensive I/O in a compact surface-mount package. Its specifications make it suitable for cost-sensitive commercial products, prototyping, and system integration where predictable supply and temperature ranges are required.

Choose this device when you need an integrated FPGA option that combines 2700 logic elements, approximately 40.96 Kbits of on-chip RAM, and 146 I/Os in a 208-pin PQFP footprint—providing a straightforward path to consolidate functions and simplify board-level design.

Request a quote or submit an inquiry to receive pricing, availability, and procurement options for the XC2S100E-6PQG208C.