XC2S100E-6FTG256C

The XC2S100E-6FTG256C is a Spartan®-IIE family FPGA supplied in a 256-LBGA package. It provides reprogrammable logic resources and on-chip memory suitable for designs that require field-upgradeable logic and configurable I/O.

Built for commercial applications, this surface-mount FPGA offers a defined logic capacity, embedded RAM, and a broad I/O count—delivering a balance of integration and predictable supply and temperature requirements for system-level designs.

Key Features

• Logic Capacity 2700 logic elements (reported) delivering approximately 100,000 system gates for implementing combinational and sequential logic functions.
• Embedded Memory Total on-chip RAM bits: 40,960 (approximately 40 Kbits) for block and distributed memory usage within designs.
• I/O Count 182 user I/O pins to support parallel interfaces, control signals, and mixed-function connectivity at the board level.
• Clock and Timing Spartan-IIE family architecture includes dedicated clock resources and delay-locked loop (DLL) support as described in the Spartan-IIE data materials.
• Power and Supply Specified supply voltage range of 1.71 V to 1.89 V for the core to match platform power budgeting and sequencing requirements.
• Package & Mounting 256-LBGA (supplier device package 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB designs.
• Operating Condition Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, supporting lead-free manufacturing and assembly processes.
• Spartan-IIE Family Capabilities The Spartan-IIE family (to which this device belongs) documents features such as block RAM and distributed RAM architectures, selectable I/O standards, and multiple DLLs for advanced clock management.

Typical Applications

• ASIC replacement and prototyping Use the FPGA’s reprogrammability to replace mask-programmed ASICs during development or to prototype system logic before ASIC commitment.
• Embedded control and signal processing Implement control logic, peripheral management, or custom data paths using the available logic elements and on-chip RAM.
• I/O expansion and interface bridging Leverage 182 I/Os to aggregate signals, adapt interfaces, or create protocol translators between subsystems.
• Field-upgradeable systems Reprogrammability enables in-field updates to logic functionality without hardware replacement, simplifying maintenance and feature upgrades.

Unique Advantages

• Highly integrated solution: 2700 logic elements and ~40 Kbits of embedded memory reduce external component count for many control and glue-logic designs.
• Flexible I/O capacity: 182 user I/Os accommodate multi-signal interfaces, allowing consolidation of discrete controllers and buffers.
• Defined electrical envelope: A narrow core supply window (1.71 V–1.89 V) helps designers plan power rails and sequencing precisely.
• Compact, solderable package: 256-LBGA surface-mount package supports space-constrained PCBs and modern assembly processes.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation aligns with a wide range of standard commercial applications.
• Regulatory-friendly: RoHS compliance facilitates integration into lead-free production flows.

Why Choose XC2S100E-6FTG256C?

The XC2S100E-6FTG256C offers a practical combination of reprogrammable logic, embedded memory, and substantial I/O in a compact 256-LBGA package. Its commercial-grade rating and clearly specified supply and temperature requirements make it a predictable choice for system designs that require field updates and consolidated logic integration.

This device suits teams and OEMs seeking a cost-effective FPGA with measurable on-chip resources and family-proven architectural features. It provides a pathway to reduce discrete component count, accelerate development cycles, and enable post-deployment updates without hardware swaps.

Request a quote or submit an inquiry to get pricing, lead times, and availability for the XC2S100E-6FTG256C. Our team can provide the next steps for procurement and integration planning.