XC2S100-6PQ208C

The XC2S100-6PQ208C is a Spartan®-II Field Programmable Gate Array (FPGA) device offering a balance of programmable logic, on-chip memory, and I/O resources in a compact 208-BFQFP package. It features 600 CLBs and 2,700 logic elements, enabling implementation of user-defined digital functions and moderate-complexity logic designs.

With 40,960 bits of embedded RAM, 140 I/O pins, a core supply range of 2.375 V to 2.625 V, and a commercial operating range of 0 °C to 85 °C, this surface-mount device is suited for designs that require flexible programmable logic and a high pin count in a space-efficient package.

Key Features

• Core Logic 600 CLBs and 2,700 logic elements provide the programmable resources needed to implement custom digital logic and state machines.
• On-Chip Memory 40,960 bits of embedded RAM support storage for registers, FIFOs, and small buffers within the FPGA fabric.
• I/O and Gate Capacity 140 user I/O pins and an estimated 100,000 gates enable broad connectivity and moderate gate-level integration for system interfaces.
• Power Supply Core voltage range of 2.375 V to 2.625 V for compatibility with target system power rails.
• Package and Mounting 208-BFQFP package (208-PQFP, 28×28) in a surface-mount form factor for PCB space-efficiency and standard assembly processes.
• Operating Conditions Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implement user-defined logic functions and prototypes using the device's CLBs and logic elements.
• I/O expansion and interface consolidation — Use the 140 I/O pins to aggregate multiple peripheral interfaces into a single programmable device.
• Embedded control and glue logic — Replace discrete logic components with programmable fabric packaged in a 208-BFQFP surface-mount IC.

Unique Advantages

• Balanced logic and memory resources: 600 CLBs and 40,960 bits of RAM provide a practical mix of logic and storage for moderate-complexity designs.
• High I/O density: 140 I/O pins support extensive external connectivity without increasing board-level component count.
• Compact surface-mount package: 208-BFQFP (28×28) package enables space-efficient PCB layouts and standard assembly.
• Clear supply and operating specifications: Defined core voltage range (2.375 V–2.625 V) and commercial temperature rating simplify system integration and qualification.
• Regulatory readiness: RoHS compliance supports environmentally driven procurement requirements.

Why Choose XC2S100-6PQ208C?

The XC2S100-6PQ208C provides an integrated FPGA solution that combines a moderate amount of programmable logic, embedded memory, and a high I/O count in a compact 208-BFQFP surface-mount package. Its defined voltage and temperature ranges make it suitable for commercial embedded designs where consolidating discrete logic and increasing board-level flexibility are priorities.

This device is well suited to engineers and procurement teams creating designs that require configurable digital logic, interface consolidation, and a predictable integration path. The combination of CLBs, logic elements, on-chip RAM, and abundant I/O offers a practical platform for scalable, maintainable designs backed by documented device specifications.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2S100-6PQ208C. Our team will assist with lead times and order details to support your design and procurement needs.