XC2S100-6FG456C

The XC2S100-6FG456C is a Spartan®-II Field Programmable Gate Array (FPGA) from AMD delivered in a 456-ball BGA package. It provides a mid-range configurable logic resource with 2,700 logic elements, approximately 40 Kbits of on-chip RAM, and up to 196 user I/O pins, suitable for commercial-grade digital designs.

Designed for surface-mount integration, this device operates from a 2.375 V to 2.625 V core supply and across a commercial temperature range of 0 °C to 85 °C, offering a balanced combination of logic capacity, embedded memory, and I/O density for a variety of embedded applications.

Key Features

• Core Logic 2,700 logic elements providing roughly 100,000 gates of programmable digital logic for implementing control, glue logic, and medium-complexity algorithms.
• Embedded Memory Approximately 40 Kbits of on-chip RAM for data buffering, small FIFOs, and state storage close to logic.
• I/O Density 196 user I/O pins to support multiple external interfaces, parallel buses, and mixed-signal front-ends when paired with appropriate external circuits.
• Package and Mounting 456-BBGA package (supplier package: 456-FBGA, 23×23) designed for surface-mount assembly to accommodate compact PCB layouts.
• Power Core supply voltage range of 2.375 V to 2.625 V to match common FPGA power rails.
• Operating Range Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements.

Typical Applications

• Embedded Control Logic Use the XC2S100-6FG456C to implement application-specific control functions and state machines where ~2,700 logic elements provide the required combinational and sequential resources.
• I/O Bridge and Interface With 196 I/O pins, the device is suitable for designs that require parallel interfaces, bus bridging, or multiple peripheral connections.
• Prototyping and Development Mid-range logic capacity and on-chip RAM make this FPGA appropriate for validating algorithms and hardware designs before scaling to higher-density devices.
• Signal Glue and Timing Logic Implement timing-critical glue logic and protocol handling leveraging the device’s programmable gates and embedded RAM.

Unique Advantages

• Balanced Logic and Memory: 2,700 logic elements paired with approximately 40 Kbits of RAM deliver a practical mix of resources for medium-complexity functions without excessive board space.
• High I/O Count: 196 user I/O pins simplify integration with multiple peripherals and external devices, reducing the need for external I/O expanders.
• Compact BGA Packaging: The 456-ball BGA (456-FBGA, 23×23) supports dense PCB layouts for space-constrained commercial products.
• Commercial Temperature Fit: Rated for 0 °C to 85 °C operation, aligning with standard commercial electronics deployments.
• Regulatory Readiness: RoHS compliance supports lead-free assembly and broader market acceptance.

Why Choose XC2S100-6FG456C?

The XC2S100-6FG456C positions itself as a practical Spartan®-II FPGA option for commercial designs that need a mid-range combination of programmable logic, embedded RAM, and substantial I/O capacity in a compact BGA package. It is well-suited for engineers building control logic, interface bridges, or prototypes where predictable operating voltages and standard commercial temperature operation are required.

Choosing this FPGA offers a clear balance of integration and flexibility—enabling designs to consolidate discrete logic, reduce component count, and accelerate development cycles while maintaining RoHS compliance for modern manufacturing workflows.

Request a quote or submit a purchase inquiry to receive pricing, lead-time, and availability information for the XC2S100-6FG456C.