XC2S100-6PQG208C

IC FPGA 140 I/O 208QFP
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 140 40960 2700 208-BFQFP

Quantity 1,583 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O140Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates100000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XC2S100-6PQG208C – Spartan®-II FPGA, 100,000 gates, 2700 logic elements, 140 I/Os

The XC2S100-6PQG208C is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD. It provides 100,000 gates, 2,700 logic elements, 600 CLBs and 40,960 bits of on-chip RAM, with 140 I/O pins in a 208-BFQFP package.

Offered in a commercial-grade, surface-mount package with a supply voltage range of 2.375 V to 2.625 V and an operating temperature of 0 °C to 85 °C, this device is positioned for mid-range logic integration where on-chip memory and ample I/O are required.

Key Features

  • Core Logic — 100,000 gates with 2,700 logic elements and 600 CLBs provide capacity for moderate complexity digital designs.
  • Embedded Memory — 40,960 bits of on-chip RAM for local buffering and small data storage needs.
  • I/O Count — 140 total I/O pins to support multiple external interfaces and peripherals.
  • Package and Mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly flows.
  • Power — Operates from a supply voltage range of 2.375 V to 2.625 V.
  • Temperature Grade — Commercial operating range from 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High integration density: 100,000 gates and 2,700 logic elements allow consolidation of logic functions into a single device, reducing board-level component count.
  • Generous I/O capacity: 140 I/Os provide flexibility for connecting multiple peripherals and external devices without immediate need for I/O expanders.
  • On-chip memory: 40,960 bits of embedded RAM enable local buffering and temporary storage, reducing reliance on external memory for small data sets.
  • Standard surface-mount package: 208-BFQFP (28×28) eases PCB layout and supports common assembly processes.
  • Commercial-grade specification: Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
  • Regulatory alignment: RoHS compliance addresses environmental and materials requirements for many product lines.

Why Choose XC2S100-6PQG208C?

The XC2S100-6PQG208C delivers a balanced mix of logic capacity, on-chip memory, and I/O count in a widely used 208-BFQFP surface-mount package. Its electrical and thermal specifications support commercial-grade designs that require moderate integration of digital logic and peripheral interfacing.

This FPGA is well suited for developers and procurement teams targeting mid-range implementations where consolidating discrete logic, maintaining board-level simplicity, and ensuring RoHS compliance are priorities. The combination of logic elements, embedded RAM, and abundant I/O helps streamline design trade-offs while keeping the BOM compact.

Request a quote or submit an inquiry for pricing and availability of the XC2S100-6PQG208C to begin integrating this Spartan®-II FPGA into your next design.

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