XC2S100-5FG256I

The XC2S100-5FG256I is a Spartan®-II field-programmable gate array (FPGA) in a 256-ball BGA package, designed for industrial embedded logic applications. It provides programmable logic resources, on-chip RAM, and a high I/O count to implement custom digital functions within a compact surface-mount package.

This device targets designs that require up to 100,000 gates, 2,700 logic elements, and 176 user I/Os while operating across an industrial temperature range and a controlled core voltage rail.

Key Features

• Logic Resources 2,700 logic elements (cells) to implement custom combinational and sequential logic.
• Embedded Memory Approximately 40 kbits of on-chip RAM (40,960 total RAM bits) for data buffering and small lookup tables.
• I/O Capacity 176 user I/Os to interface with peripherals, sensors, and other digital subsystems.
• Gate Count Up to 100,000 gates for medium-complexity digital designs.
• Package and Mounting 256-ball BGA (256-FBGA, 17×17) in a surface-mount package for compact board-level integration.
• Power Supply Core voltage range of 2.375 V to 2.625 V to match platform power domains.
• Operational Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for harsh environments.
• Compliance RoHS compliant to meet current environmental mandates.

Typical Applications

• Industrial Control Use the XC2S100-5FG256I for motor control, PLC I/O expansion, and other factory automation tasks where industrial temperature range and robust I/O are required.
• Embedded Systems Implement glue logic, protocol adaptation, or custom state machines in compact embedded platforms benefiting from the device's logic and RAM resources.
• Data Acquisition & Sensor Interfaces Leverage the 176 I/Os and on-chip RAM to aggregate, buffer, and pre-process sensor data before passing it to a host processor.

Unique Advantages

• Compact, high-density packaging: The 256-FBGA (17×17) package enables a small board footprint while providing ample I/O count for complex interconnects.
• Industrial temperature performance: Rated from −40 °C to 100 °C, suitable for deployments in extended-temperature environments.
• Balanced logic and memory: 2,700 logic elements combined with approximately 40 kbits of on-chip RAM supports a range of medium-complexity implementations without external memory.
• Clear power requirements: A defined core supply range (2.375 V to 2.625 V) simplifies power budgeting and supply design.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly and distribution.

Why Choose XC2S100-5FG256I?

The XC2S100-5FG256I offers a practical combination of programmable logic, embedded RAM, and a high I/O count in a compact BGA package, positioned for industrial and embedded applications that demand reliable operation across a wide temperature range. Its gate count and logic resources make it suitable for medium-complexity custom digital functions where board space and I/O density matter.

Designed and manufactured by AMD, this Spartan®-II FPGA provides a stable platform for designs that require deterministic device specifications, clear power requirements, and RoHS compliance—helping streamline procurement and long-term deployment in industrial settings.

Request a quote or submit an inquiry to receive pricing and availability for the XC2S100-5FG256I. Our team can provide lead time and ordering information to support your design timeline.