XAAU15P-1SBVB484Q
| Part Description |
Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 5347738 170100 484-WFBGA, FCBGA |
|---|---|
| Quantity | 440 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-WFBGA, FCBGA | Number of I/O | 204 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 9720 | Number of Logic Elements/Cells | 170100 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 | Total RAM Bits | 5347738 |
Overview of XAAU15P-1SBVB484Q – Artix® UltraScale+ FPGA IC (170,100 logic elements)
The XAAU15P-1SBVB484Q is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD, supplied in a 484-ball FCBGA / WFBGA package. It delivers reconfigurable logic capacity with 170,100 logic elements and approximately 5.35 Mbits of on‑chip RAM for embedded memory needs.
Engineered for designs that require substantial on-chip logic, integrated memory, and automotive qualification, this device supports a 204-pin I/O footprint, a low-voltage core supply range, and extended operating temperature for demanding environments.
Key Features
- Core Logic 170,100 logic elements provide the programmable fabric for implementing custom digital functions and accelerators.
- Embedded Memory Approximately 5.35 Mbits of total on‑chip RAM to support buffers, FIFOs, and local data storage without external memory for many functions.
- I/O Capability 204 user I/O pins give flexible connectivity for interfacing with sensors, peripherals, and system buses.
- Power Core voltage supply specified between 825 mV and 876 mV, allowing designers to plan power delivery and thermal profiles precisely.
- Package and Mounting Available in 484-FCBGA (19×19) and 484-WFBGA package options, optimized for surface-mount PCB assembly.
- Automotive Qualification Grade: Automotive with AEC‑Q100 qualification; suitable for applications that require automotive-grade component qualification.
- Operating Range Specified operating temperature from -40 °C to 125 °C for extended-temperature applications.
- Compliance RoHS compliant to support environmentally conscious designs.
Typical Applications
- Automotive Electronic Control Use in in-vehicle systems that require reconfigurable logic and AEC‑Q100 qualification for reliable operation across automotive temperature ranges.
- Signal Processing and Acceleration Implement custom real-time processing blocks and hardware accelerators using the device’s large logic and on-chip RAM resources.
- High‑Density I/O Interfaces Serve as a programmable interface hub for systems needing flexible I/O mapping and protocol bridging with 204 available I/O pins.
Unique Advantages
- Substantial Logic Capacity: 170,100 logic elements enable complex custom logic, reducing reliance on multiple discrete ICs.
- On‑Chip Memory: Approximately 5.35 Mbits of embedded RAM minimizes external memory needs and simplifies board design.
- Automotive‑Grade Qualification: AEC‑Q100 qualification and an operating range to 125 °C support deployment in temperature‑stressed automotive environments.
- Compact, Surface‑Mount Packaging: 484-ball FCBGA / WFBGA packages provide high integration density for space-constrained PCBs.
- Defined Power Envelope: Tight core voltage range (825–876 mV) facilitates precise power delivery design and voltage regulation planning.
Why Choose XAAU15P-1SBVB484Q?
The XAAU15P-1SBVB484Q positions itself as a high-capacity, automotive‑qualified FPGA option within the Artix® UltraScale+ family. Its combination of 170,100 logic elements, substantial embedded memory, and a 204‑pin I/O complement makes it well suited for designs that require on‑chip compute and flexible interfacing while meeting automotive qualification requirements.
For teams targeting scalable, robust designs that must tolerate extended temperatures and adhere to AEC‑Q100 qualification, this device offers a straightforward path to integrate programmable logic while keeping board-level complexity and external BOM to a minimum.
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