XAAU10P-L1SBVB484I
| Part Description |
IC FPGA ARTIXUP AUTO 484BGA |
|---|---|
| Quantity | 1,584 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-WFBGA, FCBGA | Number of I/O | 204 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5500 | Number of Logic Elements/Cells | 96250 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 | Total RAM Bits | 3670016 |
Overview of XAAU10P-L1SBVB484I – Automotive-Grade FPGA, 484-FCBGA
The XAAU10P-L1SBVB484I is a field-programmable gate array (FPGA) from AMD targeted at automotive and embedded system applications. It combines a high count of configurable logic resources with substantial on-chip memory and a broad I/O complement to support complex signal processing, control and interfacing tasks.
Key value comes from its combination of approximately 96,250 logic elements, roughly 3.67 Mbits of embedded memory, 204 I/Os, an automotive AEC‑Q100 qualification and a compact 484‑FCBGA surface-mount package—providing integration density and environmental robustness for automotive and similarly demanding deployments.
Key Features
- Logic Capacity – 5,500 configurable logic blocks (CLBs) delivering 96,250 logic elements to implement complex digital functions and custom accelerators.
- Embedded Memory – Approximately 3.67 Mbits of on-chip RAM for buffering, frame storage, LUTs and state retention in real-time designs.
- I/O Resources – 204 user I/Os to support multi‑channel sensor interfaces, communication links and board-level integration.
- Package and Mounting – 484‑WFBGA / 484‑FCBGA footprint with supplier device package listed as 484‑FCBGA (19x19); designed for surface-mount board assembly.
- Power – Operates from a low core supply range of 825–876 mV, enabling power-optimized FPGA implementations.
- Automotive Qualification – AEC‑Q100 qualification and an automotive grade rating suitable for vehicle electronics environments.
- Operating Range – Rated for operation from −40 °C to 100 °C to meet temperature demands of automotive and industrial installations.
- Regulatory – RoHS compliant to meet environmental and manufacturing requirements.
Typical Applications
- Automotive control modules – Use the device’s programmable logic, memory and 204 I/Os for domain controllers, body electronics or powertrain control where AEC‑Q100 qualification is required.
- Sensor fusion and ADAS subsystems – Implement multi-sensor aggregation and preprocessing pipelines using the FPGA’s logic capacity and embedded RAM for low-latency data handling.
- In-vehicle networking and gateways – Deploy flexible protocol bridging and signal conditioning leveraging abundant I/O and configurable logic to adapt to changing network requirements.
- Real-time signal processing – Apply on-chip memory and logic resources to implement deterministic processing for control loops, filtering and timing-critical tasks.
Unique Advantages
- Automotive-ready qualification: AEC‑Q100 qualification and automotive-grade classification enable use in vehicle electronics with documented component-level reliability.
- High integration density: Nearly 96,250 logic elements and 3.67 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and PCB layout.
- Ample I/O for system integration: 204 I/Os support diverse sensor, actuator and communication interfaces without additional bridge components.
- Compact surface-mount package: 484‑FCBGA (19x19) packaging provides a small footprint for space-constrained boards while supporting high pin counts.
- Low-voltage core operation: Core supply range of 825–876 mV supports power-efficient designs when combined with careful system-level power management.
- Wide operating temperature: Specified −40 °C to 100 °C operation suits deployment across typical automotive thermal environments.
Why Choose XAAU10P-L1SBVB484I?
The XAAU10P-L1SBVB484I positions itself as a robust, high-capacity FPGA option for designers building automotive and demanding embedded systems. Its blend of nearly 96,250 logic elements, approximately 3.67 Mbits of embedded memory, and 204 I/Os in a compact 484‑FCBGA package delivers a balance of performance, integration and board-level flexibility.
Engineers designing control modules, sensor processing pipelines or networking gateways benefit from the device’s automotive qualification, broad operating temperature range and RoHS compliance. The combination of integration density and qualification makes this FPGA suitable for teams seeking scalable, reliable programmable logic for production automotive and similar applications.
Request a quote or submit an inquiry to get pricing and availability details for XAAU10P-L1SBVB484I and discuss how this FPGA fits your next automotive or embedded design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








