XAAU10P-1SBVB484Q

IC FPGA ARTIXUP AUTO 484BGA
Part Description

Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 3670016 96250 484-WFBGA, FCBGA

Quantity 1,153 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-WFBGA, FCBGANumber of I/O204Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5500Number of Logic Elements/Cells96250
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationAEC-Q100Total RAM Bits3670016

Overview of XAAU10P-1SBVB484Q – Artix® UltraScale+ FPGA, 484‑FCBGA, AEC‑Q100

The XAAU10P-1SBVB484Q is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) supplied in a 484‑WFBGA / 484‑FCBGA package. It integrates 96,250 logic elements and approximately 3.67 Mbits of embedded RAM to support high‑density programmable logic implementations.

Engineered for automotive applications with AEC‑Q100 qualification, this surface‑mount FPGA offers a wide operating temperature range and a high IO count to address designs that require on‑chip memory, significant logic capacity, and robust environmental tolerance.

Key Features

  • Programmable Logic Capacity — 96,250 logic elements provide substantial resources for complex digital designs and custom hardware acceleration.
  • Embedded Memory — Approximately 3.67 Mbits of on‑chip RAM to support buffering, data processing, and stateful logic without external memory in many use cases.
  • I/O Density — 204 general‑purpose I/O pins to accommodate multiple peripherals, interfaces, and board‑level interconnects.
  • Package & Mounting — Supplied in a 484‑WFBGA / 484‑FCBGA (484‑FCBGA, 19×19) surface‑mount package to support compact board layouts and high‑pin counts.
  • Power Supply — Operates from a core voltage range of 825 mV to 876 mV for the FPGA core domains as specified.
  • Automotive Qualification & Temperature Range — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive and other temperature‑sensitive applications.
  • RoHS Compliant — Meets RoHS requirements for lead‑free assembly and regulatory compliance.

Typical Applications

  • Automotive systems — Suitable for automotive electronic subsystems that require AEC‑Q100 qualification and an extended temperature range.
  • High‑density programmable logic — Ideal for designs needing tens of thousands of logic elements and embedded RAM to implement custom processing pipelines or protocol engines.
  • I/O‑intensive control and interface — The 204 I/O pins support complex sensor, actuator, and peripheral interfacing on compact PCBs.

Unique Advantages

  • Automotive‑grade qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range provide confidence for vehicle environments and demanding thermal conditions.
  • High logic and memory integration: 96,250 logic elements and ~3.67 Mbits of embedded RAM reduce dependence on external components and simplify board-level design.
  • Generous I/O availability: 204 I/O pins enable flexible connectivity for multi‑channel systems and mixed‑signal interfaces.
  • Compact, high‑pin package: 484‑FCBGA (19×19) packaging offers a high pin count in a compact footprint for space‑constrained designs.
  • RoHS compliance: Facilitates lead‑free assembly and regulatory compatibility for global production.

Why Choose XAAU10P-1SBVB484Q?

The XAAU10P-1SBVB484Q positions itself as a highly integrated FPGA solution combining substantial logic capacity, on‑chip memory, and a high I/O count in a compact 484‑FCBGA package. Its AEC‑Q100 qualification and extended operating temperature range make it a suitable option for automotive and other temperature‑sensitive applications that demand reliable programmable logic.

Designers seeking to consolidate functions, reduce external BOM items, and maintain environmental robustness will find this FPGA aligned with those objectives. The combination of logic density, embedded RAM, I/O flexibility, and automotive qualification supports scalable, long‑life deployments where board‑level integration and environmental tolerance are priorities.

Request a quote or submit a procurement inquiry to get pricing and availability for XAAU10P-1SBVB484Q today.

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