XAAU10P-1SBVB484I

The XAAU10P-1SBVB484I is an Artix® UltraScale+ field programmable gate array (FPGA) from AMD, supplied in a 484‑ball FCBGA / 484‑WFBGA package. This automotive‑grade, AEC‑Q100‑qualified device delivers a combination of on‑chip logic capacity, embedded memory and I/O density for vehicle and other systems that require qualified components and robust operating conditions.

Key Features

• Logic Capacity: 96,250 logic elements (logic cells) for implementing custom digital functions and complex control logic.
• Embedded Memory: Approximately 3.67 Mbits of on‑chip RAM to support data buffering, state storage and local memory needs.
• I/O Resources: 204 general‑purpose I/O pins to support multiple interfaces and peripheral connections.
• Package & Mounting: 484‑FCBGA (19×19) supplier device package; 484‑WFBGA, FCBGA package case with surface‑mount mounting type for compact board integration.
• Voltage Supply: Core supply range 825 mV to 876 mV to match system voltage design requirements.
• Temperature Range: Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Automotive Qualification: AEC‑Q100 qualification and automotive grade designation for use in vehicle electronics development.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.

Typical Applications

• Automotive electronic control units (ECUs): AEC‑Q100 qualification and the device’s operating temperature range make it suitable for vehicle control and electronic subsystems.
• In‑vehicle I/O and interface consolidation: 204 I/Os enable integration of multiple sensors, actuators and communication interfaces on a single FPGA.
• Embedded signal and control processing: The combination of 96,250 logic elements and approximately 3.67 Mbits of RAM supports custom signal processing, control logic and protocol handling.

Unique Advantages

• Automotive‑ready qualification: AEC‑Q100 status reduces qualification overhead for vehicle programs that require qualified components.
• Significant logic capacity: 96,250 logic elements provide headroom for complex, integrated digital designs without immediate need for external logic.
• On‑chip memory reduces BOM: Approximately 3.67 Mbits of embedded RAM can lower dependency on external memory devices for many use cases.
• High I/O count for flexible interfacing: 204 I/Os allow consolidation of multiple peripheral and interface signals onto a single device.
• Robust environmental range: −40 °C to 100 °C operating range supports deployment in temperature‑challenging environments.
• Compact surface‑mount package: 484‑FCBGA (19×19) / 484‑WFBGA packaging helps save board area while supporting high‑density routing.

Why Choose XAAU10P-1SBVB484I?

The XAAU10P-1SBVB484I combines a substantial logic fabric, on‑chip memory and a high I/O count in a compact, surface‑mount FCBGA package from AMD’s Artix® UltraScale+ family. Its AEC‑Q100 qualification and wide operating temperature range make it appropriate for automotive designs and other applications that require qualified, reliable components.

Choose this part when your design requires a qualified FPGA platform with ample logic resources, embedded RAM and flexible I/O in a space‑efficient package.

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