XA7S75-2FGGA676I

The XA7S75-2FGGA676I is a Spartan®-7 field programmable gate array (FPGA) offered in a 676-ball BGA package. With 76,800 logic elements and approximately 3.32 Mbits of embedded memory, this device delivers a balanced mix of logic capacity and on-chip RAM for control, interfacing and data buffering tasks. Designed for surface-mount assembly and qualified to AEC-Q100, it targets applications that demand robust operation across a wide temperature range and high I/O density.

Key Features

• Core Logic 6,000 CLBs and 76,800 logic elements provide programmable capacity for custom logic, glue functions and hardware acceleration.
• Embedded Memory Approximately 3.32 Mbits of on-chip RAM to support buffers, FIFOs and local storage for deterministic data handling.
• I/O Density 400 I/O pins to support large numbers of peripherals, sensors and external interfaces within a single device.
• Power Core voltage supply range of 0.95 V to 1.05 V for compatibility with modern low-voltage power domains.
• Package & Mounting 676-ball FPBGA (27 × 27 mm) surface-mount package (676-BGA) for high-density board designs and reliable solderable attachment.
• Temperature & Qualification Rated for operation from -40 °C to 100 °C and AEC-Q100 qualified for automotive-grade reliability requirements.
• Compliance RoHS compliant for alignment with environmental and manufacturing requirements.

Typical Applications

• Automotive electronic systems — AEC-Q100 qualification and a -40 °C to 100 °C operating range make this FPGA suitable for in-vehicle control and interfacing tasks that require high I/O and deterministic logic.
• High-density I/O interfacing — With 400 I/O pins, the device supports complex sensor arrays, communication ports and peripheral aggregation on a single FPGA.
• Embedded control and data buffering — Approximately 3.32 Mbits of embedded memory and extensive logic resources enable local data processing, buffering and custom control logic.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 certification supports deployment in applications requiring automotive reliability and traceable qualification.
• High I/O capacity: 400 I/O pins reduce the need for external I/O expanders and simplify system routing for complex interfacing requirements.
• Balanced logic and memory: 76,800 logic elements combined with ~3.32 Mbits of RAM offer a practical balance for mixed control and buffering tasks without external memory.
• Compact, high-density package: 676-FPBGA (27×27 mm) package enables dense PCB layouts while providing robust soldered mounting for production assemblies.
• Wide operating range: Specified operation from -40 °C to 100 °C supports deployment across challenging thermal environments.

Why Choose XA7S75-2FGGA676I?

The XA7S75-2FGGA676I positions itself as a reliable, automotive-qualified FPGA with substantial logic capacity, embedded memory and high I/O count in a compact BGA package. It is well suited for designers who need programmable logic that can withstand vehicle-grade temperature and qualification requirements while consolidating multiple functions into a single device.

Choose this part when you need a scalable hardware building block for control, interfacing and local data processing tasks, supported by a compact package and RoHS compliance for production readiness.

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