XA7S6-2CPGA196I

The XA7S6-2CPGA196I is a Spartan®-7 XA field programmable gate array (FPGA) IC from AMD. It combines configurable logic with embedded RAM and a moderate I/O count to support custom digital functions in space-constrained, board-mounted designs.

With automotive grade qualification (AEC‑Q100), a specified operating temperature range of -40 °C to 100 °C, and a compact 196-ball TFBGA/CSBGA package, this device is targeted at automotive and other designs that require a qualified, surface-mount FPGA solution operating at low core voltages.

Key Features

• Logic Capacity — Provides 6,000 logic elements suitable for implementing custom digital logic, control and interfacing functions.
• Embedded Memory — Contains approximately 184,320 bits of on-chip RAM for buffering, small FIFOs and localized data storage.
• I/O Count — Offers 100 user I/O pins to support a range of external interfaces and peripheral connections.
• Package — Supplied in a 196‑ball TFBGA / CSBGA (196‑CSPBGA, 8×8) package for compact surface-mount PCB designs.
• Power — Core voltage supply specified from 0.95 V to 1.05 V to match low-voltage system designs.
• Thermal and Environmental — Operating temperature range of -40 °C to 100 °C and RoHS compliance for environmental and regulatory compatibility.
• Automotive Qualification — AEC‑Q100 qualification indicates suitability for automotive-grade requirements where AEC certification is required.
• Mounting — Surface mount device for modern PCB assembly processes.

Typical Applications

• Automotive Control Modules — Use the device for configurable logic and local memory in automotive electronics that require AEC‑Q100 qualification and extended temperature support.
• Embedded Interface Bridging — Implement custom protocol translation and I/O aggregation using the available 100 user I/Os and on-chip RAM.
• Control and Signal Processing — Deploy the FPGA where moderate logic density and embedded memory are needed for deterministic control tasks and buffering.

Unique Advantages

• Automotive-qualified silicon: AEC‑Q100 qualification provides documented suitability for automotive applications requiring component-level qualification.
• Balanced resources for compact designs: 6,000 logic elements and approximately 184,320 bits of embedded RAM deliver a balance of logic and memory for many control and interface functions without excessive board area.
• Moderate I/O density: 100 user I/Os enable a variety of external connections while keeping package size compact.
• Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports integration into low-voltage systems.
• Wide operating temperature: Rated from -40 °C to 100 °C to cover demanding thermal environments.
• Compact BGA packaging: 196‑ball TFBGA/CSBGA package (196‑CSPBGA, 8×8) minimizes PCB footprint and supports surface-mount assembly.

Why Choose XA7S6-2CPGA196I?

The XA7S6-2CPGA196I positions itself as a compact, automotive‑qualified FPGA solution that delivers a practical mix of logic, embedded memory and I/O for designs that require qualification and extended temperature capability. Its low-voltage core, surface-mount BGA package and AEC‑Q100 status make it appropriate for applications where component-level automotive qualification and a small board footprint are priorities.

Engineers and procurement teams looking for a qualified, mid-density FPGA from a recognized manufacturer can leverage this device to implement custom digital functions, interface logic and localized buffering while maintaining automotive-grade qualifications and RoHS compliance.

Request a quote or submit an inquiry to get pricing and availability for the XA7S6-2CPGA196I and to discuss how it fits your design requirements.