XA7S50-2FGGA484I

The XA7S50-2FGGA484I is a Spartan®-7 XA field programmable gate array (FPGA) from AMD, offered in a 484-ball BGA package. It combines 52,160 logic elements with approximately 2.76 Mbits of on-chip RAM and up to 250 user I/O to support a range of embedded and automotive-grade applications.

With AEC-Q100 qualification, a 950 mV to 1.05 V core supply range, and an operating temperature span of -40 °C to 100 °C, this device is targeted at designs that require a balance of integration, I/O density, and supply/thermal robustness.

Key Features

• Logic Capacity — 52,160 logic elements provide programmable fabric for custom digital functions and mid-density logic integration.
• Embedded Memory — Approximately 2.76 Mbits of on-chip RAM to support buffering, lookup tables, and moderate data-path storage.
• I/O Density — Up to 250 user I/O pins to facilitate multiple peripheral interfaces and sensor or actuator connections.
• Package and Mounting — 484-ball BGA package (484-FPBGA 23×23) in a surface-mount form factor for compact board-level integration.
• Power — Core supply range from 950 mV to 1.05 V to match system power rail options and enable predictable power budgeting.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification for use in applications requiring that industry standard.
• Operating Range — Rated for operation from -40 °C to 100 °C to meet broad environmental requirements.
• Regulatory Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Automotive Systems — Suited for automotive electronic modules that require AEC-Q100 qualification and a mix of logic and I/O resources.
• Embedded Control — Ideal for control logic, signal interfacing, and protocol bridging where mid-range logic and on-chip RAM are needed.
• I/O Aggregation and Sensor Front-Ends — High I/O count enables consolidation of multiple sensor and actuator interfaces onto a single FPGA.
• Prototyping and System Integration — Useful for designers consolidating discrete logic into a programmable device with a compact BGA package.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and automotive grade labeling provide explicit suitability for automotive design flows and validation processes.
• Balanced Integration: 52,160 logic elements paired with approximately 2.76 Mbits of RAM allow combining control, buffering, and custom logic in one device, reducing board-level parts count.
• High I/O Count: Up to 250 user I/O simplifies system-level wiring and reduces the need for external I/O expanders.
• Compact Packaging: The 484-FPBGA (23×23) package offers a dense, surface-mount footprint for space-constrained PCBs.
• Wide Operating Conditions: A -40 °C to 100 °C rating and a defined core supply window (950 mV to 1.05 V) support reliable operation across common automotive and embedded temperature and power environments.
• RoHS Compliance: Meets RoHS requirements for modern electronics manufacturing and supply chains.

Why Choose XA7S50-2FGGA484I?

The XA7S50-2FGGA484I positions itself as a mid-density Spartan®-7 XA FPGA optimized for designers who need a mix of logic capacity, on-chip memory, and substantial I/O in an automotive-qualified package. Its combination of 52,160 logic elements, approximately 2.76 Mbits of embedded RAM, and AEC-Q100 qualification make it a practical choice for embedded and automotive applications that require certified components and a compact BGA footprint.

Backed by AMD as the manufacturer, this device suits teams focused on integration and reliability while keeping board complexity and part count low. It is appropriate for projects that demand scalable programmable logic, clear supply and temperature parameters, and RoHS-compliant components.

Request a quote or contact sales to discuss availability, pricing, and how the XA7S50-2FGGA484I can fit into your next design.