XA7S50-1CSGA324Q

The XA7S50-1CSGA324Q is a Spartan®-7 XA Field Programmable Gate Array (FPGA) from AMD designed as a mid-density, automotive-qualified programmable logic device. It provides a balance of logic capacity, embedded memory and I/O to support control, signal processing and interface consolidation in temperature‑sensitive environments.

Key architectural attributes include 52,160 logic elements, approximately 2.76 Mbits of embedded memory and 250 I/Os, all delivered in a compact 324‑CSGA (15×15 mm) surface‑mount package with AEC‑Q100 qualification and a wide operating temperature range.

Key Features

• Logic Capacity  52,160 logic elements suitable for mid-range custom logic, glue logic and data‑path implementations.
• Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM for buffering, FIFOs and local storage to support streaming and packetized data flows.
• I/O  250 I/O pins to support multiple interfaces, sensor connections and board‑level integration without external glue circuitry.
• Package & Mounting  324‑CSGA (15×15) supplier device package in a tray case, designed for surface‑mount assembly.
• Power  Core voltage supply specified at 950 mV, enabling consistent power planning for system design.
• Automotive Qualification & Temperature Range  AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C suitable for temperature‑extreme electronic environments.
• Compliance  RoHS compliant.

Typical Applications

• Automotive Electronics  Automotive control modules and domain controllers that require AEC‑Q100 qualification and an extended −40°C to 125°C operating range.
• Embedded Control & Signal Processing  Custom control logic, real‑time signal handling and protocol bridging using the device’s logic element density and on‑chip RAM.
• I/O‑Intensive Systems  Gateway, sensor interface and data aggregation roles where 250 programmable I/Os simplify board‑level connectivity.

Unique Advantages

• Mid‑range Logic Density:  52,160 logic elements deliver ample capacity for complex glue logic and moderate data‑path implementations without excessive cost or board area.
• Substantial Embedded Memory:  Approximately 2.76 Mbits of on‑chip RAM reduce reliance on external memory for buffering and local storage.
• High I/O Count:  250 I/Os enable flexible interface mapping and direct connection to sensors, actuators and peripheral devices.
• Automotive‑Grade Reliability:  AEC‑Q100 qualification and a −40°C to 125°C operating range support deployment in demanding automotive and harsh‑environment applications.
• Compact Surface‑Mount Package:  324‑CSGA (15×15) package balances PCB area and thermal considerations for space‑constrained designs.
• Regulatory Compliance:  RoHS compliance supports environmental and regulatory requirements.

Why Choose XA7S50-1CSGA324Q?

The XA7S50-1CSGA324Q positions itself as a reliable, automotive‑qualified FPGA option for designs that require a blend of logic capacity, embedded memory and a high I/O count in a compact surface‑mount package. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for applications that must withstand automotive temperature extremes while maintaining programmable flexibility.

This device is well suited to engineers developing control modules, I/O aggregation systems and embedded processing blocks who need the long‑term robustness of an automotive‑qualified FPGA combined with a mid‑range feature set that simplifies BOM and board‑level integration.

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