XA7S50-1FGGA484I

The XA7S50-1FGGA484I is a Spartan‑7 XA Field Programmable Gate Array provided in a 484‑FPBGA (23×23) surface‑mount package. It combines a large logic fabric with embedded RAM and extensive I/O to support integration of complex digital functions on a single device.

This device is specified with automotive grade qualification (AEC‑Q100) and a wide operating temperature range, offering a balance of capacity, integration, and environment tolerance for designs that require qualified, compact FPGA solutions.

Key Features

• Core logic  4075 configurable logic blocks (CLBs) delivering 52,160 logic elements for implementing complex digital logic and custom functions.
• Embedded memory  Approximately 2.76 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic without relying solely on external memory.
• Flexible I/O  250 I/O pins to accommodate multiple interfaces and sensor or peripheral connections directly at the FPGA edge.
• Package & mounting  484‑FPBGA (23×23) in tray format, surface‑mount compatible for compact PCB integration.
• Automotive qualification  Grade: Automotive with AEC‑Q100 qualification for designs that require recognized automotive component standards.
• Power and temperature  Specified supply voltage of 950 mV and an operating temperature range from −40°C to 100°C for deployment across a broad set of thermal environments.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification and automotive grade marking support use in qualified applications where component qualification is required.
• High integration density: 52,160 logic elements enable consolidation of multiple functions and reduce overall system BOM.
• On‑chip memory capacity: Approximately 2.76 Mbits of embedded RAM helps minimize dependence on external memory and improves system latency.
• Wide I/O count: 250 I/O pins provide flexibility for interfacing to sensors, actuators, and communication peripherals.
• Wide operating range: −40°C to 100°C specification supports deployment in varied thermal environments.
• Compact BGA package: 484‑FPBGA (23×23) enables dense PCB layouts while maintaining surface‑mount assembly compatibility.

Why Choose XA7S50-1FGGA484I?

The XA7S50-1FGGA484I is positioned for designs that require a qualified, compact FPGA with substantial logic and memory resources alongside a high I/O count. Its automotive grade and AEC‑Q100 qualification, combined with a wide operating temperature range, make it suitable where component qualification and environmental tolerance are important.

Engineering teams seeking to integrate complex digital functionality while minimizing external components will find the device’s logic capacity, on‑chip RAM, and package density advantageous for robust, scalable designs.

Request a quote or submit a quote to evaluate XA7S50-1FGGA484I for your design requirements and to obtain pricing and availability information.