XA7S50-2CSGA324I

The XA7S50-2CSGA324I is a Spartan®-7 XA Field Programmable Gate Array (FPGA) IC from AMD, offered in a 324‑LFBGA / CSPBGA package. This device provides a balance of programmable logic capacity, embedded memory, and a high I/O count, packaged and qualified for automotive use.

With AEC‑Q100 qualification and an operating range from -40 °C to 100 °C, the device addresses applications that require automotive-grade reliability while delivering substantial on-chip logic and memory resources.

Key Features

• Logic Capacity — 52,160 logic elements enabling complex custom logic implementations and control functions.
• Embedded Memory — Approximately 2.76 Mbits of on-chip RAM for buffering, state storage, and data processing tasks.
• I/O Density — 250 I/O pins to support a wide range of peripherals, sensor interfaces, and board-level connectivity.
• Fabric Resources — 4,075 logic blocks (CLBs) providing the building blocks for instantiated logic and datapath structures.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade classification for use in vehicle systems.
• Operating Range — Rated for operation from -40 °C to 100 °C to meet extended temperature requirements.
• Supply Voltage — Core supply range of 0.95 V to 1.05 V for power planning and system design.
• Package and Mounting — 324‑LFBGA / CSPBGA package, supplier device package 324‑CSGA (15×15), surface-mount mounting for compact PCB integration.
• Environmental Compliance — RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Automotive control systems — Suited for control and logic functions in automotive environments due to AEC‑Q100 qualification and wide operating temperature range.
• Embedded signal processing — On-chip memory and 52,160 logic elements support custom signal processing, protocol handling, and data buffering.
• High‑density I/O interfacing — 250 I/O pins enable aggregation of multiple sensors, actuators, and communication endpoints on a single device.
• Compact board‑level integration — 324‑LFBGA surface‑mount package and 15×15 supplier package simplify placement in space-constrained designs.

Unique Advantages

• Automotive-grade qualification: AEC‑Q100 certification and Automotive grade classification support deployment in vehicle systems requiring qualified components.
• High programmable density: 52,160 logic elements and 4,075 CLBs provide substantial capacity for implementing complex custom logic and state machines.
• Significant on‑chip memory: Approximately 2.76 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Robust I/O resources: 250 I/O pins accommodate diverse peripheral and sensor interfaces without extensive board-level multiplexing.
• Compact, surface‑mount package: 324‑LFBGA / CSPBGA in a 15×15 supplier package facilitates integration into compact, densely populated PCBs.
• Regulatory and environmental compliance: RoHS compliance supports regulatory requirements for many markets.

Why Choose XA7S50-2CSGA324I?

The XA7S50-2CSGA324I positions itself as a capable automotive‑qualified FPGA offering a blend of programmable logic density, embedded memory, and extensive I/O in a compact surface‑mount package. Its AEC‑Q100 qualification and -40 °C to 100 °C operating range make it a fit for designs that require reliable operation across automotive temperature ranges.

This device is suitable for engineers and procurement teams seeking a Spartan‑7 XA family FPGA with measurable logic and memory resources, generous I/O, and packaging that supports compact, board‑level designs while meeting automotive qualification expectations.

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