XA7S50-1CSGA324I

The XA7S50-1CSGA324I is a Spartan®-7 field programmable gate array (FPGA) offered in a 324-LFBGA/CSPBGA package. It provides a balance of programmable logic, embedded memory, and I/O density for designs that require a qualified, automotive-grade FPGA solution.

With AEC‑Q100 qualification, an operating range from −40 °C to 100 °C, and a low-voltage core supply, this device is targeted at applications that need robust operation across temperature and automotive-level qualification.

Key Features

• Core Logic — 52,160 logic elements (logic cells) across 4,075 CLB-like blocks, enabling implementation of moderate-complexity programmable logic designs.
• Embedded Memory — Approximately 2.76 Mbits of on-chip RAM (2,764,800 bits) for frame buffers, FIFOs, and local data storage.
• I/O Density — 250 user I/Os to support multiple interfaces, sensor connections, and parallel I/O requirements.
• Power — Core voltage supply range of 950 mV to 1.05 V to match low-voltage system requirements.
• Package — 324‑LFBGA package (supplier device package: 324‑CSGA, 15×15 mm) in a surface-mount form factor for PCB space efficiency.
• Automotive Qualification & Temperature Range — Grade: Automotive with AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C for temperature-stable operation.
• RoHS Compliance — Environmentally compliant manufacturing and materials.

Typical Applications

• Automotive control systems — AEC‑Q100 qualification and wide temperature range make the device suited for in-vehicle control, monitoring, and subsystem processing.
• High-density I/O interfaces — 250 I/Os support protocol bridging, sensor aggregation, and multi-channel interface tasks requiring flexible I/O mapping.
• Embedded data buffering and processing — Approximately 2.76 Mbits of on-chip RAM and 52,160 logic elements provide local memory and logic resources for data handling and preprocessing.

Unique Advantages

• Automotive-ready qualification: AEC‑Q100 qualification and automotive grade simplify selection for vehicle applications that require qualified components.
• Compact, board-friendly package: The 324‑LFBGA (324‑CSGA, 15×15 mm) surface-mount package supports compact PCB layouts without sacrificing I/O count.
• Balanced logic and memory resources: Combined on-chip RAM and 52,160 logic elements let you implement control, buffering, and custom logic in a single device.
• Wide operating temperature range: −40 °C to 100 °C supports reliable operation across typical automotive thermal environments.
• Low-voltage core support: 950 mV to 1.05 V core supply aligns with low-power system designs and modern power rails.
• RoHS-compliant: Compliant materials ease environmental and regulatory considerations in product development.

Why Choose XA7S50-1CSGA324I?

The XA7S50-1CSGA324I positions itself as a qualified, mid-density Spartan®-7 FPGA offering a practical mix of logic capacity, embedded memory, and I/O resources in a compact 324‑LFBGA package. Its automotive grade and AEC‑Q100 qualification make it appropriate for designs that require component-level qualification and broad temperature tolerance.

This device is suitable for engineers and procurement teams developing automotive subsystems or any application that needs a qualified FPGA with substantial I/O and on-chip memory. Its combination of verified qualification, compact packaging, and balanced resources supports scalable, reliable deployments and longer-term product lifecycles.

Request a quote or submit an inquiry to get pricing and availability for the XA7S50-1CSGA324I. Our team can assist with lead times and order details.