XA7S25-1CSGA324Q

The XA7S25-1CSGA324Q is a Spartan®-7 XA field programmable gate array (FPGA) IC from AMD. It provides a compact, automotive-grade programmable logic platform with mid-range logic capacity and embedded memory for control and signal-processing tasks.

With 23,360 logic elements, approximately 1.66 Mbits of embedded memory, 150 I/O pins, and AEC-Q100 qualification, this device targets designs that require low-voltage operation, wide temperature range, and automotive-grade reliability.

Key Features

• Core Capacity — 23,360 logic elements to implement custom digital logic, state machines, and glue logic in a single device.
• Embedded Memory — Approximately 1.66 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables that support data-path and control functions.
• I/O and Packaging — 150 user I/Os in a 324‑LFBGA package with supplier device package 324-CSGA (15×15), supporting high-density board integration and flexible signal routing.
• Power — Low-voltage core supply range of 0.95 V to 1.05 V to match modern low-voltage system architectures.
• Automotive Qualification — AEC-Q100 qualification and Automotive grade designation for deployment in vehicle electronic subsystems.
• Temperature Range — Rated for operation from −40 °C to 125 °C to meet wide-temperature application requirements.
• Mounting and Compliance — Surface-mount device with RoHS compliance for standard automated assembly and environmental requirements.

Typical Applications

• Automotive Electronic Systems — Suited for vehicle subsystems that require AEC-Q100-qualified programmable logic for control, interfacing, or signal processing.
• Embedded Control — Use in embedded controllers and custom logic modules leveraging the device’s logic capacity and on-chip RAM.
• I/O Aggregation and Bridging — 150 I/Os enable consolidation of sensors, actuators, and communication endpoints into a single FPGA-based interface device.
• Low-Voltage Designs — Ideal where a 0.95–1.05 V core supply aligns with system power budgets and architectures.

Unique Advantages

• AEC-Q100 Qualified: Automotive qualification provides a defined basis for vehicle deployment and long-term reliability in temperature-stressed environments.
• Balanced Logic and Memory: 23,360 logic elements combined with approximately 1.66 Mbits of embedded RAM give designers integration headroom for mid-complexity functions without external memory.
• High I/O Density: 150 user I/Os reduce the need for external multiplexing or additional interface ICs, simplifying board-level design.
• Compact, Assembly-Friendly Package: 324‑LFBGA / 324-CSGA (15×15) packaging supports dense PCB layouts and surface-mount assembly processes.
• Wide Operating Temperature: −40 °C to 125 °C rating supports applications exposed to harsh thermal conditions.
• Low-Voltage Operation: Core supply range of 0.95–1.05 V enables integration into modern low-power systems.

Why Choose XA7S25-1CSGA324Q?

The XA7S25-1CSGA324Q positions itself as a practical, automotive-grade FPGA option for mid-complexity designs that require certified reliability, compact packaging, and a balanced combination of logic, memory, and I/O. Its specification mix supports consolidated system designs where on-chip resources reduce external components and simplify board-level integration.

This device is appropriate for engineers and procurement teams building vehicle electronics or other temperature-sensitive systems who need a qualified, low-voltage FPGA from a recognized manufacturer (AMD) with clear on-chip capacity and package definition.

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