XA7S25-1CSGA225I
| Part Description |
Spartan®-7 XA Field Programmable Gate Array (FPGA) IC 150 1658880 23360 225-LFBGA, CSPBGA |
|---|---|
| Quantity | 478 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-CSPBGA (13x13) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1658880 |
Overview of XA7S25-1CSGA225I – Spartan®-7 XA Field Programmable Gate Array, Automotive Grade
The XA7S25-1CSGA225I is a Spartan®-7 XA Field Programmable Gate Array (FPGA) IC in a 225-pin CSPBGA package, designed for applications that require programmable logic with automotive-level qualification. It integrates 23,360 logic elements and approximately 1.66 Mbits of embedded memory, combined with 150 user I/O pins for flexible system integration.
Built for surface-mount assembly and specified for a wide operating temperature range and AEC-Q100 qualification, this device targets designs where durability, compact packaging, and low-voltage operation are key requirements.
Key Features
- Core Logic 23,360 logic elements provide programmable resources for combinational and sequential logic implementation.
- Embedded Memory Approximately 1.66 Mbits of on-chip RAM for buffering, state storage, and algorithm acceleration.
- IO Capability 150 general-purpose I/O pins to support multiple interfaces and external peripherals.
- Power Specified core voltage range of 0.95 V to 1.05 V to match low-voltage system designs.
- Package & Mounting 225-CSPBGA (13×13) package in a 225-LFBGA footprint, optimized for surface-mount PCB assembly and space-constrained layouts.
- Automotive Qualification AEC-Q100 qualification and Automotive grade designation for deployment in automotive electronic systems.
- Operating Range Rated for operation from −40 °C to 100 °C to support a wide range of environmental conditions.
- Environmental Compliance RoHS compliant to meet common regulatory and manufacturing requirements.
Typical Applications
- Automotive Electronic Control Modules Suitable for controllers and subsystems where AEC-Q100 qualification is required and compact, surface-mount packaging is preferred.
- Embedded System Integration Use in embedded designs that benefit from programmable logic, on-chip RAM, and flexible I/O in a small BGA footprint.
- Signal Processing and Control Implement buffering, state machines, and custom logic functions using the device’s logic elements and embedded memory.
Unique Advantages
- Automotive-Qualified Reliability: AEC-Q100 qualification and Automotive grade marking provide a clear path for use in automotive electronics.
- Substantial Logic Resources: 23,360 logic elements enable medium-scale programmable logic implementations without external logic chips.
- On-Chip Memory: Approximately 1.66 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
- Compact, Surface-Mount Package: 225-CSPBGA (13×13) minimizes PCB area while supporting high-density system designs.
- Low-Voltage Core Operation: 0.95–1.05 V supply range supports integration into low-voltage power architectures.
- Wide Operating Temperature: −40 °C to 100 °C rating supports deployment across demanding environmental conditions.
Why Choose XA7S25-1CSGA225I?
The XA7S25-1CSGA225I positions itself as a compact, automotive-qualified FPGA option that balances programmable logic capacity, embedded memory, and a substantial I/O count in a small CSPBGA package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for designs that require both reliability and flexibility.
This device is well-suited for engineers and procurement teams seeking a scalable, RoHS-compliant FPGA component for automotive electronic modules and space-constrained embedded systems, offering straightforward integration with low-voltage power rails and surface-mount assembly processes.
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