XA7S100-2FGGA676I

The XA7S100-2FGGA676I is a Spartan®-7 XA field programmable gate array (FPGA) in a 676-ball BGA package designed for high-density, low-voltage programmable logic integration. It provides a combination of 102,400 logic elements, approximately 4.42 Mbits of embedded memory, and up to 400 I/Os, making it suitable for designs that require significant logic, on-chip RAM and extensive connectivity.

With AEC-Q100 qualification and an automotive grade designation, this device is specified for demanding environments, supporting a supply range of 0.95 V to 1.05 V and an operating temperature range of -40 °C to 100 °C. The part is offered in a 676-FPBGA (27x27) surface-mount package.

Key Features

• Core Logic  102,400 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 4.42 Mbits of on-chip RAM for data buffering, state storage and intermediate processing.
• High I/O Count  Up to 400 I/Os to support wide external interfacing and parallel connectivity.
• Power Supply  Operates from 0.95 V to 1.05 V, allowing integration into low-voltage systems.
• Package & Mounting  676-ball BGA in a 676-FPBGA (27x27) footprint, designed for surface-mount PCB assembly.
• Automotive Qualification  AEC-Q100 qualification with automotive grade marking for applications requiring that level of component qualification.
• Temperature Range  Specified for operation from -40 °C to 100 °C to cover a wide range of environmental conditions.
• RoHS Compliance  Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• Automotive Electronics  Suitable for automotive-grade designs that require AEC-Q100 qualification and robust operating temperature range.
• Embedded Control  Use in control and processing tasks that benefit from abundant logic elements and on-chip RAM for buffering and state machines.
• High-Connectivity Systems  Ideal for systems requiring many external interfaces, leveraging up to 400 I/Os for sensors, peripherals and parallel interfaces.
• Compact, Board-Level Integration  The 676-FPBGA (27x27) package supports compact PCB layouts where surface-mount BGA is required.

Unique Advantages

• Significant Logic Density: 102,400 logic elements enable implementation of complex logic without external CPLDs or additional FPGAs.
• Substantial On-Chip Memory: Approximately 4.42 Mbits of embedded RAM reduces reliance on external memory for temporary data storage and buffering.
• High I/O Capacity: 400 available I/Os simplify integration with multiple peripherals and parallel interfaces, lowering design complexity.
• Automotive-Grade Qualification: AEC-Q100 qualification supports deployment in applications that require specified automotive component qualification.
• Low-Voltage Operation: 0.95 V–1.05 V supply range suits low-power system domains and modern voltage rails.
• Compact BGA Package: 676-FPBGA (27x27) enables dense board-level integration while maintaining surface-mount assembly compatibility.

Why Choose XA7S100-2FGGA676I?

The XA7S100-2FGGA676I positions itself as a high-density, automotive-qualified FPGA option that balances significant logic capacity, embedded memory and extensive I/O in a compact BGA package. Its AEC-Q100 qualification, wide operating temperature range and RoHS compliance make it suitable for designs that require both performance and component-level qualification.

This device is well suited for engineers and system designers building control, interfacing and connectivity-centric applications that demand on-chip resources and the assurance of automotive-grade qualification, while maintaining a compact board footprint and low-voltage operation.

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