XA7S100-1FGGA484Q

The XA7S100-1FGGA484Q is a Spartan®-7 XA field programmable gate array (FPGA) in a 484-BGA package. It provides a balance of on-chip logic, embedded memory, and I/O density for designs that require reprogrammable digital logic and system integration.

Featuring automotive-grade qualification (AEC-Q100) and an extended operating temperature range, this device is targeted at applications that demand reliability across harsh temperature environments while maintaining a compact surface-mount package.

Key Features

• Core Logic — 102,400 logic elements organized across 8,000 CLBs to implement complex programmable logic and state machines.
• Embedded Memory — Approximately 4.42 Mbits of on-chip RAM for buffering, small data stores, and algorithm working memory.
• I/O Density — 338 I/O pins to support multiple parallel interfaces, sensor connections, and peripheral control.
• Power — Low-voltage core supply range from 0.95 V to 1.05 V to match modern low-voltage system rails.
• Package & Mounting — 484-ball Fine-Pitch BGA (484-FPBGA, 23×23) in a surface-mount form factor for high-density PCB designs.
• Reliability & Qualification — Automotive grade with AEC-Q100 qualification and RoHS compliance for regulated manufacturing and environmental requirements.
• Operating Range — Specified for operation from −40 °C to 125 °C to cover extended-temperature deployments.

Typical Applications

• Automotive Electronic Systems — AEC-Q100 qualification and wide temperature range make this FPGA suitable for automotive control and signal processing tasks.
• Embedded Control and Logic — High logic element count and plentiful I/O enable consolidation of control functions and custom state machines in compact systems.
• Memory-Intensive Glue Logic — On-chip RAM and dense I/O are useful for protocol bridging, buffering, and interface aggregation between subsystems.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100-rated device and specified −40 °C to 125 °C operation provide confidence for temperature-sensitive deployments.
• High Logic Capacity: 102,400 logic elements allow implementation of substantial custom logic without external programmable devices.
• Significant On-Chip Memory: Approximately 4.42 Mbits of embedded RAM reduces reliance on external memory for mid-sized buffering and data handling.
• Dense I/O Count: 338 I/Os permit extensive peripheral and sensor interfacing within a single device, simplifying system BOM.
• Compact Surface-Mount Package: 484-FPBGA (23×23) lets designers maintain a small PCB footprint while preserving signal routing density.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose XA7S100-1FGGA484Q?

The XA7S100-1FGGA484Q combines substantial programmable logic, embedded memory, and high I/O density in an automotive-qualified FPGA package. Its specified voltage and temperature ranges make it appropriate for designs that must operate across demanding environmental conditions while keeping system integration tight and flexible.

This device is well suited for engineers and system designers who require a reliable, reprogrammable platform for automotive electronics, embedded control, and interface consolidation where on-chip resources reduce part count and simplify board-level design.

Request a quote today to get pricing and availability for the XA7S100-1FGGA484Q and discuss configuration options for your design needs.