XA7K160T-1FFG676Q

The XA7K160T-1FFG676Q is a Kintex®-7 field programmable gate array (FPGA) optimized for high-performance, power-efficient automotive applications. Built on a 28 nm high-performance, low-power (HPL) high-k metal gate (HKMG) process, it delivers dense programmable logic alongside integrated analog and high-speed serial capabilities for system-level integration.

Designed for automotive environments, the device combines 162,240 logic elements, approximately 11.98 Mbits of embedded memory, and 400 user I/O in a 676-ball FCBGA package to support compute‑intensive and I/O‑rich designs across in‑vehicle and embedded systems.

Key Features

• Core Logic  162,240 logic elements provide a large programmable fabric for complex digital functions and custom hardware acceleration.
• On‑chip Memory  Approximately 11.98 Mbits of embedded RAM and 36 Kb dual‑port block RAM primitives for on‑chip data buffering and store‑and‑forward architectures.
• DSP and Math  600 DSP48 slices support high‑throughput multiply‑accumulate operations for signal processing and accelerators.
• Analog / Mixed‑Signal (XADC)  Integrated dual 12‑bit, 1 MSPS analog‑to‑digital converters with multiple channels for sensor interfacing and on‑chip monitoring.
• High‑Speed I/O and SerDes  High‑performance SelectIO with DDR3 support up to 1,600 Mb/s and serial transceivers spanning 500 Mb/s to 8.0 Gb/s for high‑bandwidth links.
• Interfaces and Peripherals  Integrated support for PCI Express® up to x4 Gen2 and configurable I/O standards including single‑ended and differential signaling.
• Security and Reliability  On‑chip support for 256‑bit AES encryption with HMAC/SHA‑256 authentication and built‑in SEU detection and correction features.
• Power and Process  28 nm HPL HKMG process and a nominal core supply range of 0.97 V to 1.03 V for optimized performance-per-watt; datasheet notes up to 50% lower power vs. prior generation devices.
• Package and Temperature  676‑ball FCBGA (27 × 27 mm, 1.0 mm ball pitch) with automotive‑grade operating range from –40 °C to 125 °C and AEC‑Q100 qualification.

Typical Applications

• Advanced Driver Assistance Systems (ADAS)  High logic density, DSP resources, and high‑speed I/O support sensor fusion, image pre‑processing, and real‑time decision logic in automotive perception stacks.
• In‑Vehicle Networking and Gateways  Multi‑protocol I/O and high‑bandwidth transceivers enable aggregation, protocol bridging, and secure data transfer across vehicle domains.
• Sensor Interfacing and Data Acquisition  Integrated XADC channels and flexible I/O make the device suitable for multi‑channel sensor sampling and preprocessing at the edge.
• Compute‑Intensive Embedded Systems  Large logic fabric and DSP slices support custom accelerators, signal processing, and embedded compute for automotive and other ruggedized applications.

Unique Advantages

• Automotive‑Qualified Platform:  AEC‑Q100 qualification and a –40 °C to 125 °C operating range make the part suitable for production automotive environments.
• High Logic Density:  162,240 logic elements allow consolidation of multiple functions into a single device, reducing system BOM and board area.
• Integrated Analog and Monitoring:  Dual 12‑bit, 1 MSPS ADCs and on‑chip sensors simplify sensor interfacing and system health monitoring without external components.
• High‑Bandwidth Interfaces:  SerDes up to 8.0 Gb/s and DDR3 support enable high‑throughput data paths for cameras, radar, and high‑speed peripherals.
• Security and Robustness:  Built‑in AES encryption with HMAC/SHA‑256 and SEU detection/correction enhance data integrity and functional reliability.
• Power‑Efficient Process:  28 nm HPL HKMG technology and a tightly specified core voltage range deliver a balance of performance and energy efficiency.

Why Choose XA7K160T-1FFG676Q?

The XA7K160T-1FFG676Q positions itself as a high‑performance, automotive‑grade FPGA that combines substantial logic capacity, DSP horsepower, embedded analog, and high‑speed connectivity in a single package. Its process and power characteristics make it suitable for designs where compute density and thermal robustness are required.

This device is a fit for engineers building in‑vehicle compute modules, sensor processing nodes, and high‑bandwidth gateways who need a certified automotive component with a broad set of on‑chip features to reduce system complexity and accelerate time to production.

Request a quote or submit an inquiry to discuss availability and pricing for the XA7K160T-1FFG676Q and to evaluate how it fits your next design.