XA7A75T-1FGG484Q

The XA7A75T-1FGG484Q is an Artix-7 field programmable gate array (FPGA) IC from AMD in a 484‑ball BGA package. It is a surface-mount device designed for applications that require substantial programmable logic, on-chip memory, and a high I/O count.

Key hardware characteristics include 75,520 logic elements, approximately 3.87 Mbits of embedded RAM, 285 I/O pins, a core supply range of 0.95–1.05 V, and an operating temperature range of −40 °C to 125 °C. The device is AEC‑Q100 qualified and specified as automotive grade, making it suitable for demanding in-vehicle environments.

Key Features

• Core Logic  75,520 logic elements for implementing complex custom logic and state machines in a single device.
• Embedded Memory  Approximately 3.87 Mbits of on-chip RAM for buffering, lookup tables, and temporary data storage.
• I/O Capacity  285 configurable I/O pins to support multiple peripherals, sensors and parallel interfaces.
• Power and Voltage  Core supply specified from 0.95 V to 1.05 V to match system power-rail requirements.
• Package & Mounting  484‑BBGA package (supplier package 484‑FBGA, 23 × 23 mm) in a surface-mount form factor for compact board layouts.
• Automotive Qualification  AEC‑Q100 qualified and graded for automotive use with an operating range of −40 °C to 125 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive Systems  In-vehicle control, sensor interfacing and preprocessing where AEC‑Q100 qualification and wide temperature range are required.
• Embedded Control  Custom control logic and state machines for embedded subsystems that need high logic density and on-chip RAM.
• Sensor Aggregation & Preprocessing  Consolidating multiple sensor inputs and performing real-time preprocessing using the device’s logic and I/O resources.

Unique Advantages

• High logic capacity: 75,520 logic elements enable integration of complex algorithms and multiple functions into a single FPGA.
• Substantial on-chip memory: Approximately 3.87 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O: 285 I/O pins support broad connectivity options for sensors, actuators, and peripherals without multiple interface ICs.
• Automotive-ready qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in automotive environments.
• Compact BGA package: 484‑ball BGA (23 × 23 mm supplier footprint) provides a high-density implementation for space-constrained boards.
• Predictable core power: Narrow core supply window (0.95–1.05 V) simplifies power-rail planning for consistent device operation.

Why Choose XA7A75T-1FGG484Q?

The XA7A75T-1FGG484Q combines a large logic fabric, significant embedded memory, and a high I/O count in a compact surface-mount BGA package, positioning it for embedded and automotive applications that require programmability and robustness. Its AEC‑Q100 qualification and extended temperature range make it suitable for in-vehicle and other environmentally challenging deployments.

This device is appropriate for engineers and teams designing systems that need to consolidate functionality, reduce external components, and maintain operation over a broad temperature range while leveraging the Artix-7 FPGA architecture from AMD.

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