XA7A50T-2CSG325I
| Part Description |
Artix-7 XA Field Programmable Gate Array (FPGA) IC 150 2764800 52160 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 458 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4075 | Number of Logic Elements/Cells | 52160 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 2764800 |
Overview of XA7A50T-2CSG325I – Artix‑7 FPGA, 52,160 Logic Elements, ~2.76 Mbits RAM, 150 I/Os, 324‑LFBGA (Automotive, AEC‑Q100)
The XA7A50T-2CSG325I is an Artix‑7 field programmable gate array (FPGA) IC from AMD, delivered in a 324‑pin LFBGA/CSPBGA package. It combines substantial programmable logic resources with embedded RAM and a high I/O count in a compact surface‑mount footprint.
Designed for applications that require qualified components and broad operating conditions, this device offers a balance of logic capacity, on‑chip memory, and automotive-grade qualification for use in designs where AEC‑Q100 qualification and extended temperature operation are required.
Key Features
- Logic Resources — 4,075 CLBs and 52,160 logic elements provide scalable programmable logic capacity for medium-density designs.
- Embedded Memory — Approximately 2.76 Mbits of on‑chip RAM to support buffering, state machines, and local data storage without external memory.
- I/O Count — 150 I/Os to support diverse peripheral interfaces and multiple signal domains in a single device.
- Power and Core Voltage — Core supply specified from 0.95 V to 1.05 V to match system power‑delivery planning and sequencing requirements.
- Package & Mounting — 324‑LFBGA / 324‑CSPBGA (15 × 15) surface‑mount package optimized for space‑constrained board designs.
- Operating Range — Rated for operation from −40 °C to 100 °C, supporting extended temperature deployments.
- Automotive Qualification — Automotive grade with AEC‑Q100 qualification for designs that require automotive component standards.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Automotive Electronics — AEC‑Q100 qualification and −40 °C to 100 °C operating range make the device suitable for electronic control units and other in‑vehicle systems that require qualified components.
- Embedded Control Systems — High I/O count and substantial logic capacity allow consolidation of control, interfacing, and preprocessing functions on a single FPGA.
- Compact, High‑Density Designs — The 324‑pin CSPBGA/LFBGA package supports space‑constrained PCBs where a combination of logic and memory is required without a large footprint.
Unique Advantages
- Qualified for Automotive Use: AEC‑Q100 qualification enables deployment in automotive contexts where component qualification is mandatory.
- Balanced Logic and Memory: 52,160 logic elements combined with approximately 2.76 Mbits of embedded RAM reduce dependence on external memory for many designs.
- High I/O Density: 150 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
- Compact Package: 324‑CSPBGA (15 × 15) surface‑mount package helps minimize board space while retaining substantial functionality.
- Extended Temperature Operation: −40 °C to 100 °C rating supports deployment in environments with wide thermal ranges.
- RoHS Compliant: Meets environmental compliance requirements for modern electronic assemblies.
Why Choose XA7A50T-2CSG325I?
The XA7A50T-2CSG325I positions itself as a versatile mid‑range Artix‑7 FPGA that brings together qualified automotive rating, a meaningful combination of logic resources and embedded memory, and a high I/O count in a compact 324‑pin BGA package. It is suitable for designers who need a qualified, space‑efficient programmable platform with enough on‑chip resources to integrate control and interface functions.
For teams focused on long‑term designs, the device’s automotive qualification, defined core voltage range, and extended operating temperature provide predictable integration and reliability, while the package and resource mix support scalable implementations across related product lines.
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