XA7A50T-2CPG236I

IC FPGA 106 I/O 238CSBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 106 2764800 52160 238-LFBGA, CSPBGA

Quantity 558 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits2764800

Overview of XA7A50T-2CPG236I – Artix-7 XA Field Programmable Gate Array (FPGA)

The XA7A50T-2CPG236I is an Artix-7 XA field programmable gate array (FPGA) in a 238-ball LFBGA/CSPBGA package. It provides a balance of on-chip logic capacity, embedded memory, and I/O in a surface-mount package targeted at applications that require integrated, programmable logic.

Key characteristics include approximately 52,160 logic elements, roughly 2.76 Mbits of embedded memory, 106 I/O, a 0.95 V–1.05 V core supply range, and an operating temperature span of −40 °C to 100 °C. The device is automotive grade and qualified to AEC-Q100.

Key Features

  • Logic Capacity  Approximately 52,160 logic elements to implement custom combinational and sequential logic functions.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
  • Programmable I/O  106 available I/O pins to interface with external devices and peripherals.
  • Power and Core Supply  Core voltage range of 0.95 V to 1.05 V to match system power rails and enable predictable power delivery.
  • Package and Mounting  238-LFBGA / CSPBGA package (supplier device package: 238-CSBGA, 10×10) with surface-mount mounting for compact PCB integration.
  • Automotive Qualification  Automotive grade device with AEC-Q100 qualification for use in applications requiring industry-recognized automotive qualification.
  • Operating Temperature  Rated for −40 °C to 100 °C operation to support a wide range of environmental conditions.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Automotive systems  Automotive-qualified designs that require programmable logic validated to AEC-Q100 and an extended operating temperature range.
  • Embedded control and custom logic  Designs that need approximately 52,160 logic elements and ~2.76 Mbits of embedded memory with flexible I/O counts for implementing custom datapaths and control logic.
  • Compact board-level integration  Surface-mount PCB designs that benefit from a 238-ball LFBGA/CSPBGA package and a compact 10×10 supplier package footprint.

Unique Advantages

  • Automotive-ready qualification: AEC-Q100 qualification and automotive grade designation enable deployment in vehicle electronics and related systems requiring qualified components.
  • Substantial on-chip resources: Approximately 52,160 logic elements combined with ~2.76 Mbits of embedded memory provide significant capacity for mid-range programmable logic designs.
  • Flexible I/O: 106 user I/O pins allow connection to a wide variety of external devices and peripherals without adding external interface logic.
  • Compact, surface-mount package: 238-LFBGA/CSPBGA packaging and a 10×10 supplier device footprint support space-constrained PCB layouts.
  • Wide operating range: −40 °C to 100 °C rating supports deployment across demanding environmental conditions.
  • Regulatory compliance: RoHS compliance simplifies use in designs requiring restricted-substance conformance.

Why Choose XA7A50T-2CPG236I?

The XA7A50T-2CPG236I positions itself as a robust mid-range Artix-7 FPGA option that combines a significant logic resource set and embedded memory with automotive-grade qualification. Its package and surface-mount form factor make it suitable for compact system designs that require programmable logic, deterministic I/O, and extended temperature operation.

This device is well suited for design teams and procurement seeking a qualified FPGA offering predictable electrical characteristics (0.95 V–1.05 V core supply), a clear thermal rating (−40 °C to 100 °C), and the on-chip resources needed to implement custom logic without excessive external components. Its qualification and compliance attributes support long-term deployment in regulated and environmentally demanding applications.

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