XA7A50T-1CSG325I

The XA7A50T-1CSG325I is an Artix-7 XA Field Programmable Gate Array (FPGA) offered in a compact 324‑LFBGA / 324‑CSPBGA package. It delivers moderate logic density combined with on‑chip embedded memory and flexible I/O resources for embedded designs.

Designed and qualified for automotive applications (AEC‑Q100), this device is targeted at systems that require a balance of programmable logic, embedded RAM, and automotive temperature and voltage tolerance.

Key Features

• Logic Capacity — 52,160 logic elements provide the programmable fabric needed for complex control, signal processing, and glue‑logic functions.
• Embedded Memory — Approximately 2.76 Mbits of on‑chip RAM to support buffering, FIFOs, and localized data storage.
• I/O Resources — 150 user I/O pins to support multiple interfaces, GPIO, and board-level connectivity.
• Package — Supplied in a 324‑LFBGA / 324‑CSPBGA package (324‑CSPBGA, 15×15) for a small board footprint and high pin density.
• Power — Core supply range from 0.95 V to 1.05 V to match system power rails and enable stable core operation.
• Temperature Range — Rated for operation from −40°C to 100°C, supporting demanding thermal environments.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade marking for use in automotive electronic designs.
• Mounting — Surface mount device for automated PCB assembly.

Typical Applications

• Automotive Control Systems — Deploy the FPGA in vehicle control modules and domain controllers that require AEC‑Q100 qualification and extended temperature capability.
• Embedded Signal Processing — Implement deterministic processing blocks and custom accelerators using the device’s logic and on‑chip RAM.
• High‑Pin‑Count I/O Interfaces — Use the 150 I/O pins for multiplexed sensor interfaces, communication gateways, and board‑level bridging functions.
• Compact System Integration — Integrate programmable logic in space‑constrained designs using the 324‑CSPBGA package.

Unique Advantages

• Automotive‑Grade Qualification: AEC‑Q100 qualification provides traceable suitability for automotive electronics and supports deployment in vehicle systems.
• Balanced Logic and Memory: 52,160 logic elements combined with approximately 2.76 Mbits of embedded RAM enables both control and data buffering within a single silicon device, reducing external component count.
• Generous I/O Count: 150 I/Os give designers flexibility to connect multiple sensors, actuators, and communication buses without complex routing or additional interface chips.
• Compact High‑Density Package: The 324‑CSPBGA (15×15) package delivers high pin density in a compact footprint for space‑constrained boards.
• Wide Operating Range: Core voltage tolerance of 0.95 V–1.05 V and an operating temperature range of −40°C to 100°C support robust operation across a variety of environmental conditions.
• Surface Mount Compatibility: Standard surface mount packaging enables automated assembly for volume production.

Why Choose XA7A50T-1CSG325I?

The XA7A50T-1CSG325I positions itself as a versatile automotive‑grade FPGA that combines a substantial logic element count, embedded RAM, and a high number of I/Os in a compact CSPBGA package. Its AEC‑Q100 qualification and wide temperature range make it suitable for electronic control applications where reliability and thermal tolerance are required.

This device is ideal for designers needing an integrated programmable solution to consolidate logic, buffering, and I/O functions—reducing bill‑of‑materials and simplifying board design—while retaining the flexibility of reprogrammable logic for updates and feature expansion.

Request a quote or submit a purchasing inquiry to evaluate XA7A50T-1CSG325I for your next design.