XA7A50T-1CSG325Q

IC FPGA 150 I/O 324CSBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 150 2764800 52160 324-LFBGA, CSPBGA

Quantity 966 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case324-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits2764800

Overview of XA7A50T-1CSG325Q – Artix-7 XA Field Programmable Gate Array (FPGA)

The XA7A50T-1CSG325Q is an Artix-7 XA Field Programmable Gate Array (FPGA) IC from AMD. It integrates 52,160 logic elements and approximately 2.76 Mbits of on-chip RAM, with 150 user I/O pins in a compact 324-pin CSPBGA/LFBGA package.

Designed for surface-mount assembly, this device operates from a 0.95 V to 1.05 V core supply and is qualified to AEC-Q100 with an operating temperature range of −40°C to 125°C, supporting designs that require extended temperature operation and automotive qualification.

Key Features

  • Core Logic  52,160 logic elements providing the programmable fabric required for custom logic implementation; includes 4,075 configurable logic blocks (CLBs).
  • Embedded Memory  Approximately 2.76 Mbits of total on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Capacity  150 user I/O pins for interfacing with external peripherals, sensors, and high-speed interfaces.
  • Package and Mounting  Available in a 324-pin LFBGA / 324-CSPBGA (15×15) package, optimized for surface-mount PCB assembly in space-constrained designs.
  • Power  Core supply voltage range of 0.95 V to 1.05 V to match system power domains and enable predictable power budgeting.
  • Automotive Qualification & Temperature  AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for applications requiring automotive-grade qualification and wide temperature operation.
  • Compliance  RoHS compliant to support environmentally conscious designs.

Typical Applications

  • Automotive Systems  Control and signal-processing functions in vehicle subsystems where AEC-Q100 qualification and extended temperature range are required.
  • Embedded Control  Custom logic, protocol bridging, and real-time control in surface-mount embedded platforms leveraging the device's logic and I/O resources.
  • Sensor and Interface Aggregation  Aggregating sensor data and implementing interface translation with available on-chip RAM and plentiful I/O.

Unique Advantages

  • Automotive-Qualified Device:  AEC-Q100 qualification provides documented suitability for designs that require automotive-grade component qualification.
  • High Logic Density:  52,160 logic elements and 4,075 CLBs allow complex FPGA designs and custom hardware acceleration within a single device.
  • Generous On-Chip Memory:  Approximately 2.76 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
  • Ample I/O in Compact Package:  150 I/Os in a 324-pin CSPBGA/LFBGA package enables dense system integration on compact PCBs.
  • Wide Operating Range:  −40°C to 125°C operating range and narrow core voltage window (0.95–1.05 V) support stable operation across demanding thermal and power conditions.
  • Regulatory Compliance:  RoHS compliance supports environmentally constrained product designs and global regulatory requirements.

Why Choose XA7A50T-1CSG325Q?

The XA7A50T-1CSG325Q balances substantial programmable logic capacity with embedded memory and significant I/O in a compact 324-pin package. Its AEC-Q100 qualification and extended temperature range make it appropriate for designs that require automotive-grade qualification and reliable operation across a wide thermal envelope. With a defined core supply window and surface-mount package options, the device fits into designs where predictable power behavior and PCB assembly compatibility are priorities.

This FPGA is well suited to engineering teams building compact, automotive-qualified or temperature-demanding embedded systems that need integrated logic, memory, and I/O in a single programmable device from AMD.

Request a quote or submit your requirements today to get pricing and availability for the XA7A50T-1CSG325Q.

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