XA7A75T-2CSG324I

The XA7A75T-2CSG324I is an Artix‑7 XA field programmable gate array (FPGA) supplied in a 324‑CSPBGA (15×15 mm) surface‑mount package. It delivers 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and up to 210 user I/Os in a compact footprint designed for automotive and embedded control use.

With an AEC‑Q100 qualification, a wide operating temperature range and a low core voltage range, this device is positioned for applications that require a combination of integration density, robust operating conditions, and board‑level space efficiency.

Key Features

• Core Capacity  75,520 logic elements provide substantial programmable logic resources for complex custom functions and hardware acceleration.
• Embedded Memory  Approximately 3.87 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage for real‑time processing pipelines.
• I/O Count  Up to 210 user I/Os to interface with sensors, actuators, communication transceivers and peripheral devices.
• Power and Voltage  Core supply range of 950 mV to 1.05 V to match system power rails and support optimized power delivery.
• Package & Mounting  324‑CSPBGA (15×15) package in a 324‑LFBGA format, surface‑mount compatible for high‑density board layouts.
• Automotive Qualification & Temperature  Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C for demanding environments.
• Compliance  RoHS compliant for regulatory and environmental conformity.

Typical Applications

• Automotive control systems  Implement ECU logic, signal conditioning and real‑time control tasks that benefit from programmable hardware and AEC‑Q100 qualification.
• Sensor fusion and signal processing  Use the FPGA’s logic density and embedded RAM for aggregation and pre‑processing of high‑rate sensor data streams.
• In‑vehicle networking and gateway  Leverage abundant I/Os to interface between vehicle networks and domain controllers or to implement protocol bridging.
• Embedded test and measurement  Create custom data acquisition and deterministic processing pipelines where predictable I/O timing and local memory are required.

Unique Advantages

• High integration density: 75,520 logic elements reduce the need for multiple discrete devices, simplifying BOM and board routing.
• Compact, production‑ready package: 324‑CSPBGA (15×15) enables space‑efficient designs for constrained automotive and embedded PCBs.
• Automotive‑grade reliability: AEC‑Q100 qualification and −40 °C to 100 °C operation support deployment in vehicle environments.
• Ample I/O connectivity: 210 user I/Os provide flexible interfacing options for sensors, actuators and communication modules.
• On‑chip memory for real‑time tasks: Approximately 3.87 Mbits of embedded RAM supports buffering and low‑latency processing close to the logic.
• RoHS compliant: Meets environmental compliance expectations for production and end‑product assembly.

Why Choose XA7A75T-2CSG324I?

The XA7A75T-2CSG324I combines substantial programmable logic, embedded memory and a high I/O count in a compact 324‑CSPBGA package targeted at automotive and embedded applications. Its AEC‑Q100 qualification and extended temperature range offer designers a reliable platform for vehicle electronics and other demanding environments.

This device is well suited to engineers and teams building scalable, highly integrated systems that require deterministic hardware performance, flexible I/O routing and board‑area efficiency while adhering to automotive qualification standards.

Request a quote or submit an inquiry to obtain pricing and availability for the XA7A75T-2CSG324I.