XA7A75T-2FGG484I

IC FPGA 285 I/O 484FBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 285 3870720 75520 484-BBGA

Quantity 499 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits3870720

Overview of XA7A75T-2FGG484I – Artix-7 XA Field Programmable Gate Array (FPGA) IC 484-BBGA

The XA7A75T-2FGG484I is an Artix-7 XA field programmable gate array (FPGA) designed for applications that require significant logic capacity, embedded memory and high I/O density in a surface-mount BGA package. With 75,520 logic elements, approximately 3.87 Mbits of on-chip RAM and 285 I/O pins, this device targets complex embedded and control designs where integration, I/O capability and automotive-grade qualification matter.

Qualified to AEC-Q100 and specified for a wide operating temperature range, the device is suited for designs that demand reliability across challenging environmental conditions while maintaining a single-core voltage supply between 950 mV and 1.05 V.

Key Features

  • Core Logic — 75,520 logic elements provide substantial programmable logic capacity for complex algorithms and control functions.
  • Embedded Memory — Approximately 3.87 Mbits of on-chip RAM to support data buffering, lookup tables and intermediate storage without external memory.
  • High I/O Count — 285 I/O pins enable broad connectivity to sensors, actuators and peripheral devices in high-density systems.
  • Power Supply — Specified supply range of 950 mV to 1.05 V for core operation, allowing predictable power planning.
  • Package & Mounting — 484-BBGA package in a surface-mount format; supplier package listed as 484-FBGA (23x23) for board-level integration.
  • Automotive Qualification — Grade: Automotive with AEC-Q100 qualification and RoHS compliance for regulated manufacturing and deployment.
  • Operating Temperature — Rated for operation from -40°C to 100°C to support temperature-challenging environments.

Typical Applications

  • Automotive Electronic Control — AEC-Q100 qualification and -40°C to 100°C range make the device suitable for vehicle subsystems requiring programmable logic and robust operation.
  • High-Density I/O Systems — With 285 I/O pins, the FPGA supports designs that require extensive sensor, actuator or peripheral interfacing.
  • Embedded Signal and Data Processing — Large logic capacity and on-chip RAM enable local processing, buffering and custom data-path implementations.
  • Compact, Surface-Mount Designs — The 484-BBGA surface-mount package supports space-constrained PCBs where a high-density programmable device is needed.

Unique Advantages

  • Substantial Logic Integration: 75,520 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
  • Embedded Memory for Local Storage: Approximately 3.87 Mbits of on-chip RAM supports buffering and state storage without immediate dependence on external memory.
  • High Pin Count for System Connectivity: 285 I/O pins allow flexible interfacing options for multi-sensor and multi-peripheral designs.
  • Automotive-Grade Reliability: AEC-Q100 qualification and automotive grade designation provide confidence for use in regulated vehicle environments.
  • Temperature Resilience: Rated operation from -40°C to 100°C enables deployment across a wide range of environmental conditions.
  • RoHS Compliant: Meets RoHS requirements for environmental and manufacturing compliance.

Why Choose XA7A75T-2FGG484I?

The XA7A75T-2FGG484I combines a large programmable logic fabric, substantial embedded memory and high I/O density in a surface-mount 484-BBGA package, making it a compact, integrated solution for complex embedded and automotive applications. Its AEC-Q100 qualification, broad operating temperature range and RoHS compliance position the device for designs that require both performance and reliability under demanding conditions.

This FPGA is suited to design teams building scalable, logic-intense systems that benefit from high on-chip memory, extensive I/O and automotive-grade qualification. The combination of these specifications supports longer-term value through reduced component count and predictable environmental performance.

Request a quote or submit a sales inquiry to get pricing and availability for the XA7A75T-2FGG484I.

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