XA7S100-1FGGA676Q

The XA7S100-1FGGA676Q is a Spartan®-7 XA field programmable gate array (FPGA) from AMD designed for applications requiring a high logic count, substantial embedded memory, and robust I/O capacity. This surface-mount device integrates 102,400 logic elements with approximately 4.42 Mbits of on-chip RAM and 400 I/O, providing a compact, programmable platform in a 676-BGA package (676-FPBGA, 27×27).

Qualified to AEC-Q100 and specified for automotive grade use, the device operates from 0.95 V to 1.05 V and across a wide temperature range of −40 °C to 125 °C, making it suitable for designs that demand extended temperature capability and automotive qualification.

Key Features

• Logic Capacity — 102,400 logic elements for implementing complex digital functions and custom processing blocks.
• Embedded Memory — Approximately 4.42 Mbits of on-chip RAM to support buffering, state machines, and local data storage needs.
• I/O Density — 400 available I/O pins to interface with sensors, peripherals, and high-pin-count subsystems.
• Power Supply — Core voltage range from 0.95 V to 1.05 V to match system power domains.
• Package & Mounting — 676-BGA (supplier package: 676-FPBGA, 27×27) in a surface-mount format for compact PCB integration.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification for deployment in automotive electronic systems.
• Operating Temperature — Rated for −40 °C to 125 °C to support designs exposed to wide temperature extremes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive electronic systems — Automotive-qualified FPGA suitable for control, interfacing, and in-vehicle processing where AEC-Q100 is required.
• Rugged embedded electronics — Wide operating temperature and automotive grade make it appropriate for embedded systems operating in harsh environments.
• High-density I/O designs — Large I/O count supports complex sensor, actuator, and peripheral interfacing in compact layouts.

Unique Advantages

• High logic integration: 102,400 logic elements provide capacity for complex, customized digital designs without external ASICs.
• Substantial on-chip memory: Approximately 4.42 Mbits of embedded RAM reduces the need for external memory in many buffering and state-heavy functions.
• Extensive I/O: 400 I/O pins enable broad system connectivity and flexible partitioning of signals across the FPGA.
• Automotive-grade qualification: AEC-Q100 qualification supports deployment in automotive and other high-reliability applications.
• Wide temperature range: −40 °C to 125 °C rating helps ensure reliable operation in temperature-stressed environments.
• Compact BGA footprint: 676-FPBGA (27×27) package offers a high-pin-count solution in a space-efficient form factor for PCB-constrained designs.

Why Choose XA7S100-1FGGA676Q?

The XA7S100-1FGGA676Q combines a high logic element count, multi-megabit embedded RAM, and a large I/O complement in a compact, surface-mount 676-BGA package. Its AEC-Q100 qualification and wide operating temperature range position it for automotive and rugged embedded projects that require programmable flexibility alongside reliability.

This part is suited to designers and teams that need scalable hardware programmability with verified automotive qualification and compact packaging—enabling integration of complex digital functions while managing board space and thermal constraints.

Request a quote or submit an inquiry for XA7S100-1FGGA676Q to begin the procurement process and evaluate suitability for your design needs.