XA7S25-1CSGA324I

The XA7S25-1CSGA324I is a Spartan®-7 XA field programmable gate array (FPGA) IC from AMD. It provides a balanced combination of logic capacity, embedded memory, and I/O in a compact 324-LFBGA surface-mount package targeted at designs requiring automotive qualification and wide temperature operation.

With 23,360 logic elements and approximately 1.66 Mbits of on-chip RAM, this device is suited for embedded control, signal processing, and I/O‑rich applications that require a ruggedized, qualified FPGA solution.

Key Features

• Core Logic  23,360 logic elements provide the programmable fabric for custom digital functions and hardware acceleration.
• Embedded Memory  Approximately 1.66 Mbits of on-chip RAM for data buffering, state storage, and small memory-mapped functions.
• I/O Count  150 I/O pins to support multiple interfaces, sensors, and peripherals in a single FPGA package.
• Power  Low-voltage core operation with a supply range of 0.95 V to 1.05 V to match modern low-voltage power rails.
• Package & Mounting  324-LFBGA (324-CSGA, 15×15) surface-mount package for a compact board footprint and high-density routing.
• Temperature & Qualification  Operating range from -40 °C to 100 °C and AEC‑Q100 qualification for automotive system integration.
• Compliance  RoHS-compliant material status for regulatory and environmental conformance.

Typical Applications

• Automotive control systems  AEC‑Q100 qualification and -40 °C to 100 °C operation make this FPGA suitable for in-vehicle control, sensor interfacing, and subsystem logic.
• Embedded signal processing  On-chip RAM and 23,360 logic elements support real-time data handling, preprocessing, and custom acceleration tasks.
• High-density I/O hubs  150 I/Os enable aggregation and protocol bridging for systems that require multiple external interfaces.
• Compact system integration  The 324-LFBGA (15×15) package allows designers to include substantial programmable logic in space-constrained assemblies.

Unique Advantages

• Automotive-qualified platform: AEC‑Q100 qualification provides documented suitability for automotive applications and related reliability requirements.
• Substantial on-chip resources: 23,360 logic elements combined with approximately 1.66 Mbits of embedded RAM reduce the need for external logic and memory components.
• Flexible I/O capability: 150 I/Os support diverse peripheral connections and simplify board-level integration.
• Low-voltage operation: Core supply range of 0.95 V to 1.05 V aligns with modern low-voltage power architectures to help optimize system power delivery.
• Compact, manufacturable package: 324-LFBGA (324-CSGA, 15×15) surface-mount package balances density and board-level routing for production environments.
• Wide operating temperature: -40 °C to 100 °C operation supports deployment across a broad range of environmental conditions.

Why Choose XA7S25-1CSGA324I?

The XA7S25-1CSGA324I positions itself as a rugged, automotive‑qualified Spartan‑7 XA FPGA that combines a meaningful logic capacity and embedded memory with a high I/O count in a compact LFBGA footprint. Its low-voltage core and broad temperature range make it appropriate for designs that require dependable operation across varied conditions.

This device is well suited to engineers and procurement teams building automotive subsystems, embedded controllers, and I/O-dense modules who need a qualified FPGA with on-chip resources that can reduce external BOM and streamline system design.

Request a quote or submit an inquiry to receive pricing and availability details for XA7S25-1CSGA324I and to discuss how this Spartan‑7 XA FPGA can fit your next design.