XA7S25-2CSGA324I

The XA7S25-2CSGA324I is a Spartan®-7 XA Field Programmable Gate Array (FPGA) IC supplied in a 324-LFBGA CSPBGA package. It provides approximately 23,360 logic elements and roughly 1.66 Mbits of embedded memory, a 150-pin I/O count, and a low-voltage core operating range of 0.95 V to 1.05 V. Specified for automotive grade use with AEC-Q100 qualification and an operating range from −40 °C to 100 °C, this device targets designs that require moderate logic density, compact packaging, and extended temperature operation.

Key Features

• Core Logic Approximately 23,360 logic elements for implementing mid-range digital designs and custom logic functions.
• Embedded Memory Total on-chip RAM of 1,658,880 bits—approximately 1.66 Mbits—suitable for buffering, small FIFOs, and local data storage.
• I/O Capability 150 available I/O pins to support multiple peripheral interfaces and mixed-signal front-end connections.
• Power Core voltage supply range of 0.95 V to 1.05 V, enabling low-voltage FPGA operation.
• Package & Mounting 324-LFBGA, CSPBGA package (supplier device package 324-CSGA, 15 × 15 mm) in a surface-mount form factor for compact PCB designs.
• Temperature & Qualification Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory RoHS compliant for adherence to environmental material requirements.

Typical Applications

• Automotive Control Modules AEC-Q100 qualification and −40 °C to 100 °C operation make this FPGA suitable for electronic control units and automotive signal processing functions.
• Embedded Systems with Moderate Logic Needs Approximately 23,360 logic elements and 1.66 Mbits of embedded memory provide the capacity for custom mid-range compute and control implementations.
• High I/O Integration 150 I/Os accommodate designs that require multiple sensor interfaces, actuator lines, or peripheral connectivity within a single device.

Unique Advantages

• Automotive-Qualified Component: AEC-Q100 qualification supports use in automotive applications where supplier qualification is required.
• Balanced Logic and Memory: The combination of ~23,360 logic elements and ~1.66 Mbits of RAM meets a range of mid-density implementation needs without over-provisioning.
• Compact, Surface-Mount Package: The 324-LFBGA (324-CSGA, 15 × 15 mm) package enables space-efficient PCB layouts for constrained form factors.
• Wide Operating Temperature: Specified −40 °C to 100 °C operation supports designs exposed to broad thermal environments.
• Low-Voltage Core: 0.95 V to 1.05 V supply range supports low-power core operation and system power budgeting.
• RoHS Compliance: Meets environmental material requirements for regulated markets.

Why Choose XA7S25-2CSGA324I?

The XA7S25-2CSGA324I positions itself as a mid-density, automotive-grade FPGA option that combines a substantial logic element count, embedded memory, and a generous I/O complement in a compact surface-mount LFBGA package. Its AEC-Q100 qualification and extended temperature range make it appropriate for designs that require qualified components and reliable operation across harsh thermal conditions.

This device is suited for engineers and procurement teams developing automotive and embedded systems that need a balance of integration, moderate on-chip resources, and a standardized package footprint—delivering scalability and component-level robustness backed by documented device specifications.

If you require pricing, availability, or a formal quote for XA7S25-2CSGA324I, request a quote or contact sales to submit your requirements and receive next steps.