XA7S6-1CSGA225I

IC FPGA 100 I/O 225CSGA
Part Description

Spartan®-7 XA Field Programmable Gate Array (FPGA) IC 100 184320 6000 225-LFBGA, CSPBGA

Quantity 475 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSGA (13x13)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case225-LFBGA, CSPBGANumber of I/O100Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs469Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits184320

Overview of XA7S6-1CSGA225I – Spartan®-7 XA Field Programmable Gate Array, 100 I/O, 6,000 logic elements

The XA7S6-1CSGA225I is a Spartan®-7 XA field programmable gate array (FPGA) in a 225‑pin LFBGA/CSPBGA package. It provides approximately 6,000 logic elements and 184,320 bits of on‑chip RAM, combined with a 100‑pin I/O capability and a low-voltage core supply range.

Designed and manufactured by AMD with AEC‑Q100 qualification, this device targets applications that require a compact, automotive‑qualified programmable logic element with defined logic, memory and I/O capacity and extended temperature operation.

Key Features

  • Logic Capacity  Approximately 6,000 logic elements (cells) to implement custom logic, control and glue‑logic functions.
  • Embedded Memory  Approximately 0.18 Mbits of on‑chip RAM (184,320 bits) for buffering, small FIFOs or distributed storage.
  • I/O  100 general‑purpose I/O pins to support peripheral interfaces and signal aggregation.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to match low‑voltage system architectures.
  • Package and Mounting  225‑pin LFBGA (CSPBGA) surface‑mount package; supplier device package listed as 225‑CSGA (13×13 mm).
  • Automotive Qualification  AEC‑Q100 qualification for use in vehicle electronic environments.
  • Operating Temperature  Rated for operation from −40 °C to 100 °C to meet extended temperature requirements.
  • Environmental Compliance  RoHS‑compliant.

Typical Applications

  • Automotive control modules  AEC‑Q100 qualification and extended temperature range make this FPGA suitable for electronic control units and vehicle subsystems requiring programmable logic.
  • Vehicle sensor interfacing  100 I/O pins and on‑chip memory capacity support aggregation and preprocessing of sensor signals in compact, automotive designs.
  • Compact embedded logic  The 225‑pin CSPBGA package and mid‑range logic capacity fit space‑constrained applications that need custom logic and I/O handling.
  • Low‑voltage core architectures  Designed for systems using a 0.95–1.05 V core supply.

Unique Advantages

  • Automotive‑qualified platform: AEC‑Q100 qualification indicates suitability for vehicle electronic environments and associated qualification processes.
  • Balanced logic and memory: Approximately 6,000 logic elements paired with ~0.18 Mbits of embedded RAM provides a compact balance of fabric and storage for common control tasks.
  • Generous I/O count: 100 I/O pins enable multiple peripheral connections without external multiplexing.
  • Compact surface‑mount package: 225‑pin LFBGA/CSPBGA (225‑CSGA, 13×13 mm) supports high‑density board layouts in constrained spaces.
  • Extended temperature operation: −40 °C to 100 °C rating supports deployment across typical automotive temperature ranges.
  • Vendor pedigree: Supplied by AMD as part of the Spartan®‑7 XA family, providing a known manufacturer source for procurement and lifecycle planning.

Why Choose XA7S6-1CSGA225I?

The XA7S6-1CSGA225I delivers a focused combination of logic capacity, on‑chip memory and I/O in a compact, automotive‑qualified package. Its low core voltage range and extended temperature rating make it suitable for vehicle electronics and other applications that require qualified, robust programmable logic within a constrained board footprint.

This device is well suited to teams and designs that need a mid‑density FPGA from a recognized manufacturer, with clear electrical and environmental specifications for procurement and system integration.

Request a quote or submit a procurement inquiry to evaluate the XA7S6-1CSGA225I for your next automotive or compact embedded design.

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