XA7S75-1FGGA484Q

The XA7S75-1FGGA484Q is a Spartan®-7 XA Field Programmable Gate Array (FPGA) from AMD, provided in a 484-ball BGA package. It combines a substantial logic resource set with embedded RAM and a high pin count to address embedded control, interfacing and signal-processing tasks.

With AEC-Q100 qualification, an extended operating temperature range and a compact surface-mount package, this device targets applications requiring both integration density and automotive-grade reliability.

Key Features

• Logic Capacity — Provides 76,800 logic elements for implementing custom digital functions, finite-state machines, and glue-logic integration.
• Embedded Memory — Approximately 3.32 Mbits of on-chip RAM to support buffering, small data stores and local memory for processing blocks.
• I/O Density — 338 I/O pins to support extensive peripheral, sensor and bus interfacing from a single device.
• Package and Mounting — 484-ball FPBGA (23 × 23) package in a surface-mount form factor for compact PCB designs.
• Power — Core voltage support from 0.95 V to 1.05 V to match system power-rail requirements.
• Automotive Qualification — AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for deployment in automotive environments.
• RoHS Compliance — Environmentally compliant with RoHS requirements.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and extended temperature range make the device suitable for in-vehicle electronic controllers and sensor interface modules.
• Embedded Control and Signal Processing — Large logic capacity and on-chip RAM enable custom control logic, protocol handling and signal processing pipelines.
• High-Density I/O Systems — 338 I/O pins allow aggregation of multiple sensors, actuators and communication interfaces on a single FPGA.

Unique Advantages

• Highly integrated logic and memory: 76,800 logic elements paired with ~3.32 Mbits of embedded RAM reduce the need for external logic and memory components.
• Automotive-grade robustness: AEC-Q100 qualification and −40 °C to 125 °C operation support demanding temperature environments and automotive deployment.
• Extensive I/O capability: 338 I/Os simplify system routing and permit consolidation of multiple interfaces into one device.
• Compact surface-mount BGA: The 484-FPBGA (23 × 23) package provides a space-efficient footprint for high-density PCBs.
• Controlled core voltage range: 0.95 V to 1.05 V core supply compatibility for integration into modern vehicle and embedded power architectures.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly.

Why Choose XA7S75-1FGGA484Q?

The XA7S75-1FGGA484Q positions itself as a practical solution where significant programmable logic, on-chip memory and a high I/O count are required in a compact, automotive-qualified package. Its combination of 76,800 logic elements, approximately 3.32 Mbits of embedded RAM and AEC-Q100 qualification makes it suitable for designers targeting robust embedded and automotive applications that demand integration and temperature resilience.

Choose this FPGA when you need to consolidate multiple functions onto a single, surface-mount BGA device while maintaining compliance with RoHS and AEC-Q100 requirements. The part is appropriate for teams building scalable, durable designs that require a balance of logic resources, memory and I/O density.

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