XAAU10P-1FFVB676Q

The XAAU10P-1FFVB676Q is a field-programmable gate array from AMD targeted for applications requiring automotive qualification and extended temperature operation. It combines a high logic capacity with substantial embedded memory and a high I/O count to support complex, multi‑signal designs in demanding environments.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, this device addresses designs that require robust component-level reliability together with a compact 676‑FCBGA package and surface-mount mounting.

Key Features

• Logic Capacity — 96,250 logic elements and 5,500 CLBs provide substantial programmable logic resources for complex functions and custom hardware accelerators.
• Embedded Memory — Approximately 3.67 Mbits of on‑chip RAM for buffering, lookup tables, and local data storage without external memory dependence.
• I/O Density — 228 user I/Os to support multiple parallel interfaces, sensor arrays, or high‑pin-count subsystems.
• Power Supply — Operates from 0.825 V to 0.876 V, enabling integration into low‑voltage system power rails.
• Automotive Qualification — AEC‑Q100 qualification and automotive grade designation for use in vehicle electronics and other high‑reliability applications.
• Thermal and Environmental Range — Rated for operation from −40 °C to 125 °C and compliant with RoHS requirements.
• Package and Mounting — 676‑FCBGA (27 × 27 mm) package in a surface‑mount form factor to support high‑density PCB layouts.

Typical Applications

• Automotive control modules — Suited for vehicle control electronics where AEC‑Q100 qualification and wide temperature range are required.
• High‑density I/O subsystems — Useful for gateway, interface, or signal‑aggregation functions that need many external connections.
• Embedded memory‑dependent logic — On‑chip RAM supports buffering, real‑time processing, and local data storage for latency‑sensitive tasks.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification and automotive grade designation provide component‑level assurance for vehicle electronics.
• High programmable logic density: 96,250 logic elements and 5,500 CLBs enable implementation of complex digital functions and custom hardware acceleration.
• Significant on‑chip memory: Approximately 3.67 Mbits of embedded RAM reduces reliance on external memory and simplifies board design.
• Wide operating temperature: −40 °C to 125 °C rating supports demanding thermal environments found in automotive and ruggedized applications.
• Compact, high‑pin package: 676‑FCBGA (27×27) with 228 I/Os balances high integration with a compact footprint for space‑constrained PCBs.
• Low‑voltage operation: 0.825–0.876 V supply range allows integration into modern low‑voltage system domains.

Why Choose XAAU10P-1FFVB676Q?

The XAAU10P-1FFVB676Q positions itself as a reliable, automotive‑qualified FPGA offering a balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package. Its AEC‑Q100 qualification and extended temperature rating make it suitable for designs where environmental robustness and parts qualification are priorities.

This device is a fit for teams designing vehicle electronics, high‑density interface modules, or any application that benefits from substantial on‑chip resources and automotive-level qualification. The combination of logic elements, embedded RAM, and 228 I/Os helps reduce external components and supports scalable hardware architectures.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XAAU10P-1FFVB676Q. Our team can assist with technical details and delivery timelines to support your design schedule.