XAAU10P-L1FFVB676I

The XAAU10P-L1FFVB676I is a field programmable gate array (FPGA) provided by AMD, offered in a 676-ball FCBGA package. It delivers a significant logic fabric and embedded memory suited to designs that require on-chip programmability with automotive-grade qualification.

With AEC-Q100 qualification and an extended operating range, this device targets applications that demand reliability across automotive temperature and voltage conditions while providing a high count of I/O and embedded resources for system integration.

Key Features

• Logic Capacity  Provides 5,500 CLBs and 96,250 logic elements to implement complex programmable logic functions and custom datapaths.
• Embedded Memory  Approximately 3.67 Mbits of on-chip RAM for buffers, FIFOs, and local storage to support data-intensive processing.
• I/O Resources  228 general-purpose I/O pins to interface with sensors, peripherals, and high-speed system buses.
• Package and Mounting  676-FCBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Power  Operates from a core voltage supply range of 825 mV to 876 mV, enabling consistent core power delivery within the specified window.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for deployments requiring recognized automotive component standards.
• Temperature Range  Specified operating temperature from −40 °C to 100 °C for reliable operation across extended thermal conditions.
• RoHS Compliance  RoHS-compliant construction to meet environmental and regulatory expectations.

Typical Applications

• Automotive electronic systems  Use this AEC-Q100-qualified FPGA for in-vehicle processing tasks that require programmable logic and reliable operation across the automotive temperature range.
• Control and signal processing  Leverage the device’s logic and on-chip RAM to implement real-time control algorithms and data buffering for embedded control modules.
• High-density I/O hubs  The 228 I/O pins support integration of multiple sensors, actuators, and communication interfaces within a single programmable device.

Unique Advantages

• Automotive-qualified component:  AEC-Q100 qualification reduces risk for vehicle-level designs that require validated component-level reliability.
• High logic and memory density:  Combines 96,250 logic elements with approximately 3.67 Mbits of embedded RAM to support complex algorithms and local data storage without external memory.
• Robust I/O capacity:  228 I/Os allow consolidation of multiple interface functions, lowering board-level component count.
• Compact FCBGA packaging:  676-ball FCBGA (27×27) enables a high-density footprint suitable for space-constrained assemblies.
• Extended operating window:  Wide temperature range and defined core voltage window support stable operation across automotive environmental conditions.

Why Choose XAAU10P-L1FFVB676I?

The XAAU10P-L1FFVB676I positions itself as a reliable, high-capacity FPGA option for automotive and other demanding embedded applications. Its combination of substantial logic elements, embedded memory, and a high I/O count supports complex integration while reducing external component requirements.

Designed for engineers who need programmable flexibility with device-level automotive qualification, this part delivers a balance of integration, durability, and board-level density—backed by specifications that address temperature, voltage, packaging, and regulatory compliance.

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