XAAU15P-1FFVB676Q

The XAAU15P-1FFVB676Q is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) in a 676-ball FCBGA package designed for applications requiring significant on-chip logic and memory in a ruggedized form. With 170,100 logic elements, approximately 5.35 Mbits of embedded memory and 228 user I/O, this device targets complex, high-density programmable logic functions where integration and reliability are important.

Qualified to AEC-Q100 and rated for an extended operating range of -40°C to 125°C, the device is suitable for automotive and other high-reliability embedded systems that require deterministic I/O and a compact surface-mount form factor.

Key Features

• Core Logic  170,100 logic elements provide a large programmable fabric for complex digital designs and custom hardware acceleration.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM supports buffering, frame storage, and memory-intensive algorithms without external memory in many use cases.
• I/O Density  228 user I/O pins enable broad interfacing to sensors, transceivers, and system peripherals for flexible board-level integration.
• Package and Mounting  676-ball FCBGA (27 × 27 mm) surface-mount package delivers a compact, high-pin-count solution for space-constrained PCBs.
• Automotive Qualification  AEC-Q100 qualification and an operating temperature range of -40°C to 125°C support use in automotive and high-reliability environments.
• Power Envelope  Specified core supply range of 825 mV–876 mV enables precise power budgeting for system-level thermal and power management.
• Compliance  RoHS compliant, facilitating use in regulated production environments.

Typical Applications

• Automotive control and safety systems  AEC-Q100 qualification and extended temperature rating make this FPGA suitable for advanced vehicle electronics that require reliable programmable logic and on-chip memory.
• Embedded processing and signal conditioning  Large logic capacity and multi-megabit embedded RAM enable implementation of custom signal processing pipelines and data buffering on-chip.
• Protocol bridging and high-density I/O  With 228 I/O pins, the device is well suited for applications needing numerous interfaces, protocol conversion, or custom I/O timing.
• Compact system integration  The 676-FCBGA surface-mount package supports high integration in space-constrained PCBs for industrial and transportation electronics.

Unique Advantages

• High integration density: Consolidates large logic and memory resources into a single FCBGA, reducing board-level component count and simplifying system architecture.
• Automotive-grade reliability: AEC-Q100 qualification and extended temperature operation support deployment in demanding environmental conditions.
• Flexible I/O capability: 228 user I/Os allow designers to implement wide peripheral connectivity and custom interfacing without additional bridging chips.
• Predictable power envelope: Narrow core supply range (825 mV–876 mV) assists in designing accurate power delivery and thermal solutions.
• RoHS compliance: Meets environmental and manufacturing requirements for regulated product lines.

Why Choose XAAU15P-1FFVB676Q?

The XAAU15P-1FFVB676Q combines substantial programmable logic resources, several megabits of embedded RAM, and a high I/O count in a compact 676-FCBGA package, positioning it for designs that require on-chip integration and reliable operation across a wide temperature range. Its AEC-Q100 qualification and RoHS compliance make it a pragmatic choice for automotive and other high-reliability embedded systems.

This device is ideal for engineers building scalable, robust solutions where integration, deterministic I/O, and long-term availability matter. The combination of logic capacity, embedded memory, and automotive qualification delivers a balance of performance and reliability for demanding applications.

Request a quote or submit an inquiry to obtain pricing and availability for XAAU15P-1FFVB676Q and to discuss how this FPGA can be integrated into your next design.