XAAU15P-L1SBVB484I

The XAAU15P-L1SBVB484I is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD. It combines a high count of configurable logic blocks with embedded memory and a 204‑pin I/O footprint in a 484‑ball FCBGA package tailored for surface‑mount assembly.

With AEC‑Q100 qualification and an automotive grade designation, this device targets automotive electronics and other applications requiring a qualified, reconfigurable logic platform that operates across a broad temperature and low‑voltage range.

Key Features

• Core Logic  Approximately 170,100 logic elements organized across 9,720 configurable logic blocks (CLBs), enabling complex programmable logic implementations.
• Embedded Memory  Approximately 5.35 Mbits of on‑chip RAM for buffering, lookup tables, and state storage in custom logic designs.
• I/O  204 user I/O pins provide flexible external interfacing for sensors, actuators, and communication peripherals.
• Power  Specified core supply voltage range from 698 mV to 742 mV to support the device's operating requirements.
• Package & Mounting  484‑WFBGA (484‑FCBGA, 19×19) surface‑mount package for high‑density board integration.
• Automotive Qualification  Grade: Automotive with AEC‑Q100 qualification indicated for designs that require qualified components.
• Operating Range  Rated for operation from −40 °C to 100 °C to accommodate a wide range of environmental conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive Electronics  Configurable logic for vehicle electronic control units (ECUs) and subsystem integration where AEC‑Q100 qualification is required.
• In‑Vehicle Signal Processing  On‑chip memory and abundant logic resources for implementing custom signal conditioning, filtering, and protocol bridging.
• High‑Density Board Designs  Compact 484‑ball FCBGA package suited to space‑constrained embedded systems requiring significant programmable logic and I/O.

Unique Advantages

• Substantial Logic Capacity: The combination of ~170,100 logic elements and 9,720 CLBs supports complex, highly parallel designs without immediate need for external logic.
• On‑Chip Memory: Approximately 5.35 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Automotive Qualification: AEC‑Q100 qualification provides documented suitability for automotive design processes and supply chain integration.
• Wide Thermal Range: −40 °C to 100 °C operating range supports harsher environments typical of vehicle electronics and related applications.
• Compact, High‑Density Package: 484‑FCBGA (19×19) ballout enables high integration in space‑constrained assemblies while providing 204 I/Os for system connectivity.
• RoHS Compliant: Meets common environmental regulations for lead‑free PCB assembly.

Why Choose XAAU15P-L1SBVB484I?

The XAAU15P-L1SBVB484I positions itself as a capable, automotive‑qualified FPGA option that balances large programmable logic capacity with substantial on‑chip memory and a compact package. Its specified low core‑voltage range and extended operating temperature make it suitable for designs where qualified, reconfigurable hardware is required across a wide environmental envelope.

This device is well suited for engineering teams and OEMs building automotive electronic systems or other applications that demand qualified components, significant logic and memory resources, and a dense surface‑mount package for board‑level integration.

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