XC2S100-5FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA

Quantity 669 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates100000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XC2S100-5FG256C – Spartan®-II FPGA, 256‑BGA (2,700 logic elements)

The XC2S100-5FG256C is a Spartan®-II field programmable gate array (FPGA) delivered in a 256-BGA package. It provides a moderate logic capacity and on-chip memory for implementing custom digital logic in compact, surface-mount form factors.

Designed for commercial-temperature applications, this device is suited to system designs that require configurable logic, a substantial I/O count, and controlled voltage supply requirements.

Key Features

  • Core & Logic  Approximately 2,700 logic elements and around 100,000 gates provide the programmable fabric for custom digital implementations.
  • Embedded Memory  Approximately 0.041 Mbits of on-chip RAM (40,960 bits) for buffering, small FIFOs, and local data storage.
  • I/O Capacity  176 user I/O pins to support dense peripheral connections and multiple interface signals.
  • Package & Mounting  256-BGA (supplier device package: 256-FBGA 17×17) in a surface-mount configuration for compact board integration.
  • Power  Core/operating voltage range of 2.375 V to 2.625 V to match systems designed around this supply window.
  • Operating Range & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Environmental  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.

Typical Applications

  • Digital Logic Prototyping  Implement and validate custom logic functions and control algorithms during product development and proof-of-concept phases.
  • Embedded System Integration  Consolidate glue logic, peripheral interfacing, and custom control paths in compact commercial equipment.
  • Interface Bridging  Bridge and adapt signals between different subsystems using the device's programmable I/O and logic resources.
  • Evaluation & Education  Use as a platform for learning programmable logic design and for hands-on verification of digital architectures.

Unique Advantages

  • Balanced Logic Capacity: 2,700 logic elements and ~100,000 gates offer a practical trade-off between capability and board-level footprint for commercial designs.
  • On-chip Memory for Local Storage: Approximately 0.041 Mbits of embedded RAM enables local buffering and small data structures without external memory.
  • High I/O Density in a Compact Package: 176 I/O pins in a 256-BGA (17×17) package support multiple interfaces while keeping PCB area low.
  • Controlled Power Requirements: A defined supply window of 2.375 V to 2.625 V simplifies power rail design for compatible systems.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C, making it appropriate for a wide range of commercial products and environments.
  • RoHS Compliant: Supports lead-free manufacturing and supply-chain environmental requirements.

Why Choose XC2S100-5FG256C?

The XC2S100-5FG256C positions itself as a practical Spartan®-II FPGA option for designers who need moderate logic resources, meaningful on-chip RAM, and a high I/O count in a compact 256-BGA package. Its surface-mount FBGA footprint and defined supply and temperature ranges make it straightforward to integrate into commercial electronic products.

This device is well suited for development teams and product engineers seeking a configurable logic component that balances integration density, power planning, and manufacturability while maintaining RoHS compliance.

Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time details for the XC2S100-5FG256C.

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