XAAU15P-1FFVB676I

The XAAU15P-1FFVB676I is an AMD-manufactured FPGA provided in a 676-ball FCBGA package. It combines a high count of configurable logic resources with substantial on-chip memory and a broad I/O complement for designs requiring dense, reconfigurable logic.

With AEC-Q100 qualification and an automotive grade designation, this device targets applications that require extended temperature range and supply tolerance while delivering significant integration for control, signal processing, and interface tasks.

Key Features

• Configurable Logic  9,720 CLBs and 170,100 logic elements provide a large fabric for implementing complex digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM supports buffering, lookup tables, and intermediate storage for data-intensive logic.
• I/O Density  228 I/O pins enable extensive external interfacing for sensors, actuators, and high-channel-count connectivity.
• Package  676-FCBGA (27 × 27 mm) package case designed for surface-mount assembly and high-density board layouts.
• Power  Operational supply range specified at 825 mV to 876 mV for the device core.
• Thermal and Environmental  Operating temperature range from −40 °C to 100 °C supports deployment in thermally challenging environments.
• Qualification & Grade  Automotive grade device with AEC-Q100 qualification and RoHS compliance for regulated markets and supply-chain requirements.

Typical Applications

• Automotive Control Systems  AEC-Q100 qualification and extended temperature range make this FPGA suitable for automotive control and signal-processing tasks that require reliable operation across varying temperatures.
• High-Density Signal Processing  Large logic element count and embedded RAM enable implementation of parallel DSP pipelines and custom processing engines.
• Interface and Bridging  With 228 I/Os, the device is well suited for protocol bridging, sensor aggregation, and I/O-rich interface controllers.
• Memory-Intensive Logic  Approximately 5.35 Mbits of on-chip RAM supports buffering, frame storage, and lookup-table implementations for embedded applications.

Unique Advantages

• High Logic Capacity: 170,100 logic elements and 9,720 CLBs enable implementation of large, complex designs without external FPGA partitions.
• Substantial Embedded Memory: Approximately 5.35 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
• Extensive I/O Support: 228 I/Os simplify system-level integration by accommodating numerous external interfaces and parallel channels.
• Automotive-Grade Qualification: AEC-Q100 qualification and specified operating range support deployment in automotive and other demanding environments.
• Compact, Board-Level Friendly Package: 676-FCBGA (27×27 mm) surface-mount package supports high-density PCB designs while providing robust mechanical mounting.

Why Choose XAAU15P-1FFVB676I?

The XAAU15P-1FFVB676I offers a balance of high logic density, embedded memory, and broad I/O capability in a qualified automotive-grade package. It is suited for engineers who need reconfigurable logic that can operate across extended temperature ranges and meet AEC-Q100 requirements.

This part is appropriate for designs that require scalable, on-chip resources for signal processing, control logic, and multi-channel interfacing while keeping system BOM and board complexity under control. The combination of package, supply range, and device resources provides a robust platform for long-term, production-grade deployments.

Request a quote or submit an inquiry to receive pricing, availability, and configuration assistance for the XAAU15P-1FFVB676I.