XAAU10P-1FFVB676I

The XAAU10P-1FFVB676I is an AMD field-programmable gate array (FPGA) device provided in a 676-FCBGA (27×27) surface-mount package. It delivers substantial programmable logic density and on-chip memory while meeting automotive qualification.

With approximately 96,250 logic elements, roughly 3.67 Mbits of embedded RAM, and 228 I/Os, this device is targeted at engineers building designs that require a qualified, compact FPGA solution with defined thermal and supply requirements.

Key Features

• Core Capacity — Approximately 96,250 logic elements provide a large fabric for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 3.67 Mbits of on-chip RAM support buffering, packet processing, and state storage without external memory for many use cases.
• I/O Density — 228 I/O pins give flexibility for high-pin-count interfaces, multiple peripherals, and mixed-signal routing requirements.
• Package & Mounting — Supplied in a 676-FCBGA (27×27) package with surface-mount mounting, enabling compact board-level integration.
• Power Supply — Core voltage specified between 0.825 V and 0.876 V, enabling predictable power design and regulation for the FPGA core.
• Operating Range & Qualification — Qualified to AEC-Q100 with an operating temperature range of −40 °C to 100 °C, suitable for automotive-rated electronic designs.
• Regulatory Compliance — RoHS compliant for use in lead-free manufacturing environments.

Typical Applications

• Automotive Systems — Engine, body, or chassis subsystems that require AEC-Q100 qualification and operation from −40 °C to 100 °C can leverage the device’s logic capacity and I/O density.
• Vehicle Signal Processing — On-board processing tasks that need embedded memory and programmable logic for sensor interfacing and data handling.
• Embedded Control Electronics — Compact, surface-mount FPGA integration for control functions where a qualified package and defined voltage/temperature ranges are required.

Unique Advantages

• Automotive-qualified design readiness: AEC-Q100 qualification and a −40 °C to 100 °C operating range support deployment in automotive environments that require component-level qualifications.
• Substantial logic capacity: Approximately 96,250 logic elements enable complex design partitioning and hardware acceleration without immediate redesign.
• Significant on-chip RAM: Roughly 3.67 Mbits of embedded memory reduce reliance on external RAM for many buffering and state-storage needs.
• High I/O count: 228 I/Os provide flexible connectivity options for multi-interface designs and dense peripheral routing.
• Compact, industry-standard package: 676-FCBGA (27×27) surface-mount package offers a balance of pin count and board-space efficiency for constrained layouts.
• Defined core voltage window: Specified 0.825–0.876 V supply range simplifies core power regulator selection and margin planning.

Why Choose XAAU10P-1FFVB676I?

The XAAU10P-1FFVB676I combines a large programmable fabric, meaningful embedded memory, and a high I/O count in a compact 676-FCBGA package while carrying AEC-Q100 qualification. These attributes make it suitable for designs that demand automotive-grade components with predictable electrical and thermal behavior.

This device is appropriate for engineering teams developing automotive and other high-reliability embedded systems that require a well-specified FPGA element—providing capacity, I/O flexibility, and on-chip memory to help contain system complexity and board-level component count.

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