XAM3359AZCZ

IC MPU SITARA 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 324-NFBGA (15x15)

Quantity 1,066 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1 TIEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
Security FeaturesCryptography, Random Number GeneratorSupplier Device Package324-NFBGA (15×15)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of XAM3359AZCZ – IC MPU SITARA 324NFBGA

The XAM3359AZCZ is a Texas Instruments Sitara AM335x series microprocessor IC featuring a single ARM® Cortex®-A8 32‑bit core in a 324‑NFBGA (15x15) package. It targets embedded applications that require integrated connectivity, display capability and hardware security primitives.

Key on‑chip features include multimedia/NEON SIMD co‑processing, flexible memory controller support, dual Gigabit Ethernet, USB 2.0 with PHY and CAN interface, making it suited to display‑centric and networked embedded designs that operate across a commercial temperature range.

Key Features

  • Core — Single ARM® Cortex®-A8 32‑bit processor providing the primary compute capability for embedded workloads.
  • Co‑processors — Multimedia and NEON™ SIMD support for accelerated media and signal processing tasks.
  • Memory support — Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L memory technologies to accommodate a range of system memory designs.
  • Display subsystem — LCD and touchscreen display interface controllers plus graphics acceleration for responsive user interfaces and visual output.
  • High‑speed connectivity — Two 10/100/1000 Mbps Ethernet ports and dual USB 2.0 with PHY for wired network and peripheral connectivity.
  • Additional interfaces — CAN interface for robust control and field‑bus connectivity in embedded systems.
  • Security features — On‑chip cryptography and a random number generator to support secure communications and data protection.
  • Package & mounting — Supplier device package is 324‑NFBGA (15x15); package case listed as 324‑LFBGA, intended for surface mount assembly.
  • Commercial grade & temperature range — Rated for commercial grade operation with an operating temperature range of 0 °C to 90 °C.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Industrial automation — Embedded controllers and machine interfaces that leverage Ethernet and CAN for deterministic connectivity and fieldbus integration.
  • HMI and touchscreen systems — LCD and touchscreen controllers combined with graphics acceleration to drive responsive operator displays.
  • Networking and gateway devices — Dual Gigabit Ethernet and USB 2.0 interfaces suitable for routers, gateways and edge communication modules.
  • Multimedia embedded devices — NEON SIMD and multimedia co‑processor support for media playback, simple image processing and user‑facing applications.

Unique Advantages

  • Single‑chip integration: Combines a Cortex‑A8 core with display, connectivity and security blocks to reduce external component count and simplify board design.
  • Flexible memory options: Supports LPDDR, DDR2, DDR3 and DDR3L controllers to match different performance and cost targets.
  • Dual Gigabit Ethernet: Two 10/100/1000 Mbps ports provide high‑throughput wired networking without external controllers.
  • Hardware security primitives: On‑chip cryptography and RNG support secure communications and key generation inside the device.
  • Compact surface‑mount package: 324‑NFBGA (15x15) supplier package supports dense PCB layouts for space‑constrained systems.
  • Manufacturer backing: Part of the Texas Instruments Sitara AM335x series with manufacturer documentation available for system integration.

Why Choose XAM3359AZCZ?

The XAM3359AZCZ positions a single ARM® Cortex®-A8 core with integrated multimedia, display and connectivity peripherals in a compact surface‑mount package, making it appropriate for embedded designs that require a balance of compute, interfaces and security. Its support for multiple DRAM types and dual Gigabit Ethernet enables flexible system architectures across display‑centric and networked applications.

As a Sitara AM335x series device from Texas Instruments, the XAM3359AZCZ is supported by manufacturer documentation and is RoHS compliant, offering a solution for commercial‑grade embedded projects that require integrated peripherals and hardware security features.

Request a quote or submit an inquiry for pricing and availability of the XAM3359AZCZ to begin integrating this Sitara AM335x microprocessor into your next embedded design.

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