Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AT91M40800-33AI
AT91M40800-33AIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,389
AT91M40800-33AI-T
AT91M40800-33AI-TMicrochip TechnologyIC MCU 16/32BIT ROMLESS 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,009
AT91M40800-33AU
AT91M40800-33AUMicrochip TechnologyIC MCU 16/32BIT ROMLESS 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
892
AT91M40800-33AU-999
AT91M40800-33AU-999Microchip TechnologyIC MCU 16/32BIT ROMLESS 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
820
AT91M42800-33AI
AT91M42800-33AIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
128
AT91M42800-33CI
AT91M42800-33CIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
1,732
AT91M42800A-33AI
AT91M42800A-33AIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
399
AT91M42800A-33AU
AT91M42800A-33AUMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
468
AT91M42800A-33AU-999
AT91M42800A-33AU-999Microchip TechnologyIC MCU 16/32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
593
AT91M42800A-33CI
AT91M42800A-33CIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
1,075
AT91M42800A-33CJ
AT91M42800A-33CJMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
242
AT91M42800A-33CJ-999
AT91M42800A-33CJ-999Microchip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
54
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
934
AT91M43300-25CC
AT91M43300-25CCMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A0°C ~ 70°C
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
3K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
874
AT91M43300-25CJ
AT91M43300-25CJMicrochip TechnologyIC MCU 16/32BIT ROMLESS 144BGAMicrocontrollers144-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
3K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-BGA (13×13)
Package / Case:
144-LFBGA
171
AT91M55800-33AI
AT91M55800-33AIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176TQFPMicrocontrollers176-TQFP (24x24)N/A-40°C ~ 85°C
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
176-TQFP (24×24)
Package / Case:
176-LQFP
1,182
AT91M55800-33CIN/AAT91M55800-33CIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176BGAMicrocontrollers176-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (13×13)
Package / Case:
176-LFBGA
552
AT91M55800A-33AI
AT91M55800A-33AIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176TQFPMicrocontrollers176-TQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TQFP (24×24)
Package / Case:
176-LQFP
257
AT91M55800A-33AU
AT91M55800A-33AUMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
589
AT91M55800A-33CI
AT91M55800A-33CIMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176BGAMicrocontrollers176-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (13×13)
Package / Case:
176-LFBGA
781
AT91M55800A-33CI-T
AT91M55800A-33CI-TMicrochip TechnologyIC MCU 16/32BIT ROMLESS 176BGAMicrocontrollers176-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
33MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
58
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-BGA (13×13)
Package / Case:
176-LFBGA
897

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