Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ATSAMD21E17D-MU
ATSAMD21E17D-MUMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
378
ATSAMD21E17D-MUT
ATSAMD21E17D-MUTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
541
N/A
ATSAMD21E17D-UUTMicrochip TechnologyMCU WLCSP 48MHZMicrocontrollers35-WLCSP (2.78x2.58)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
35-WLCSP (2.78×2.58)
Package / Case:
35-XFBGA, WLCSP
47
ATSAMD21E17L-AF
ATSAMD21E17L-AFMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
649
ATSAMD21E17L-AFT
ATSAMD21E17L-AFTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
770
ATSAMD21E17L-MF
ATSAMD21E17L-MFMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
900
ATSAMD21E17L-MFT
ATSAMD21E17L-MFTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,139
ATSAMD21E17L-MN
ATSAMD21E17L-MNMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,226
ATSAMD21E17L-MNT
ATSAMD21E17L-MNTMicrochip TechnologyIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.63V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,532
ATSAMD21E18A-AF
ATSAMD21E18A-AFMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
755
ATSAMD21E18A-AFT
ATSAMD21E18A-AFTMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
900
ATSAMD21E18A-AU
ATSAMD21E18A-AUMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
940
ATSAMD21E18A-AUT
ATSAMD21E18A-AUTMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32TQFPMicrocontrollers32-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFP (7×7)
Package / Case:
32-TQFP
1,180
ATSAMD21E18A-MF
ATSAMD21E18A-MFMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
471
ATSAMD21E18A-MFT
ATSAMD21E18A-MFTMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
581
ATSAMD21E18A-MU
ATSAMD21E18A-MUMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
609
ATSAMD21E18A-MUT
ATSAMD21E18A-MUTMicrochip TechnologyIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
700
ATSAMD21G15B-AF
ATSAMD21G15B-AFMicrochip TechnologyIC MCU 32BIT 32KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
934
ATSAMD21G15B-AFT
ATSAMD21G15B-AFTMicrochip TechnologyIC MCU 32BIT 32KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
571
ATSAMD21G15B-AU
ATSAMD21G15B-AUMicrochip TechnologyIC MCU 32BIT 32KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
1,069

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