Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
C8051F330
C8051F330Silicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
186
C8051F330-GDI
C8051F330-GDISilicon LabsIC MCU 8BIT 8KB FLASH DIEMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
Die
1,297
C8051F330-GM
C8051F330-GMSilicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
573
C8051F330-GMR
C8051F330-GMRSilicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,252
C8051F330-GP
C8051F330-GPSilicon LabsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
703
C8051F330D
C8051F330DSilicon LabsIC MCU 8BIT 8KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
201
C8051F330P
C8051F330PSilicon LabsIC MCU 8BIT 8KB FLASH 24DIPMicrocontrollers24-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
24-DIP
Package / Case:
24-DIP (0.300″”, 7.62mm)
1,083
C8051F330R
C8051F330RSilicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
629
C8051F331
C8051F331Silicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
532
C8051F331-GM
C8051F331-GMSilicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
799
C8051F331-GMR
C8051F331-GMRSilicon LabsIC MCU 8BIT 8KB FLASH 20MLPMicrocontrollers20-MLP (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-MLP (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,184
C8051F332-GM
C8051F332-GMSilicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
208
C8051F332-GMR
C8051F332-GMRSilicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
227
C8051F333-GM
C8051F333-GMSilicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
516
C8051F333-GMR
C8051F333-GMRSilicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,324
C8051F334-GM
C8051F334-GMSilicon LabsIC MCU 8BIT 2KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
496
C8051F334-GMR
C8051F334-GMRSilicon LabsIC MCU 8BIT 2KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,088
C8051F335-GM
C8051F335-GMSilicon LabsIC MCU 8BIT 2KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
725
C8051F335-GMR
C8051F335-GMRSilicon LabsIC MCU 8BIT 2KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
740
C8051F336-GM
C8051F336-GMSilicon LabsIC MCU 8BIT 16KB FLASH 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
387

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